–2018 IEEE XXV International Conference on Electronics, Electrical Engineering and Computing–

VENUE: Universidad Nacional Mayor de San Marcos. Lima, Peru
DATES: 8 – 10 August 2018

INTERCON 2018 aims to bring together researchers, professionals, students and entrepreneurs to promote the exchange of ideas and the promotion and production of research in various technological fields. INTERCON facilitate the approach, identification and commitment to joint challenges that allow greater access to and development of technologies for the benefit of humanity, as it is the vision of the IEEE.

INTERCON 2018 will be held in Lima, World Heritage Site and Gastronomic Capital of Latin America with 483 years of creation. Museums with great Works of art, archaeological sites, beaches, the boardwalk, valleys, natural reserves, the nightlife, the thrill of adventure sports, and the exquisite cuisine gives Peru’s capital an authentic personality and makes tourism in Lima a unique experience in the country.

The Conference Organizing Committee invites you to submit full length original research contributions from engineering professionals from industries, R&D organizations, academic institutions, government departments and research scholars from across the world. The manuscript should not have been published in any journals/magazines or conference proceedings and not under review any of them. All the submitted manuscripts will be sent for peer review and the corresponding author will be notified the outcome of the review process.

—-TOPICS—-
The topics include, but they are not limited to:
–COMPUTING–
Algorithms and Complexity
Architecture and Organization
Graphics and Visualization
Human-Computer Interaction
Information Assurance and Security
Information Management
Intelligent Systems
Networking and Communications
Operating Systems
Parallel and Distributed Computing
Software Engineering
Social Issues and Professional Practice
–ELECTRONICS AND COMMUNICATIONS–
Broad Band Communication
Computer and Intelligent Communication
Mobile and Optical Communication
Wireless Communication
Mobile and Optical Networks
Wireless Sensor Networks
Network Security
Advanced VLSI Systems
Embedded Wireless Systems
Signal and Image Processsing
Artificial Intelligence
Aerospace Technology
Biomedical Engineering
Control Systems
Robotics
–ELECTRICAL ENGINEERING–
Geo-informative Systems
Soft Computing Techniques in Power Systems
Feedback Control Systems
Power Electronics and Energy Efficient Drives
Renewable Power Conversion Technologies
Instrumentation and Control
Power Quality Improvement Techniques
Expert Systems and Artificial Intelligence Techniques

–IMPORTANT DATES–
Full paper submission deadline:           April 30, 2018
Notification of acceptance:                   June 15, 2018
Final paper submission deadline:         June 30, 2018
Oral presentations:                               August 08-10, 2018

–PAPERS SUBMISSION–
The official language of 2018 IEEE INTERCON is ENGLISH (both written and oral presentations). Papers must be submitted in PDF and should be no longer than 4 pages, following the IEEE Conference format, available on:
http://www.ieee.org/conferences_events/conferences/publishing/templates.html

Papers can be submitted using the EasyChair System by accessing the following address:
https://easychair.org/conferences/?conf=2018ieeeintercon

–CONFERENCE WEBSITE–
www.intercon.org.pe

–CONFERENCE CONTACTS–
Conference Chair: Santiago León (santiago.leon@ieee.org)
Technical Program Chair: Carlos Silva (csilva@pucp.edu.pe)
Publication Chair: José Durán (joseduran@ieee.org)