The 2021 IEEE XXVIII International Conference on Electronics, Electrical Engineering and Computing – INTERCON aims to bring together researchers, professionals, students and entrepreneurs to facilitate the approach, identification and commitment to join challenges that allow the development of technologies for the benefit of humanity.

2020 INTERCON will be a VIRTUAL CONFERENCE.

Topics of interest include, but are not limited to:
Communication systems
Semiconductors and devices
Computers and information technology
Signal processing
Systems and control
Emerging technologies
Circuits and systems
Power generation, transmission and distribution
Renewable energy sources, Smartgrid technologies
Optoelectronic materials, devices and systems
Power electronics, systems and applications
Electrical machines and adjustable speed drives
High voltage engineering and insulation technology
Algorithms and complexity
Architecture and organization
Graphics and visualization
Information management, assurance and security
Intelligent systems
Parallel and distributed Computing
Software engineering
Social issues and professional practice

Submission:
The official language of 2021 IEEE INTERCON is ENGLISH. The maximum number of authors per paper, including co-authors is four (4). Papers must be submmited in PDF and no longer than four (4) pages, following the IEEE Conference Template available at:
https://www.ieee.org/conferences/publishing/templates.html
We will use EasyChair system for submissions here: https://easychair.org/conferences/?conf=2021ieeeintercon

Important dates
Full paper submission deadline: May 15, 2021
Notification of acceptance: June 30, 2021
Final paper submission deadline: July 10, 2021
Author registration: July 15, 2021
Oral presentations: August 5 to 7, 2021

More information: https://www.intercon.org.pe/2021/