Deadline extension to July 31: IEEE Symposium on Computational Intelligence for Engineering Solutions 2023

Dear Colleague,

the submission deadöine has been extended to July 31, 2023:

We would like to kindly invite you to submit a paper to the

IEEE Symposium on Computational Intelligence for Engineering Solutions – CIES 2023

which we are organizing within the

IEEE Symposium Series on Computational Intelligence,  

Mexico City, Mexico, December 5 – 8, 2023

https://attend.ieee.org/ssci-2023/
 

An outline of our Symposium is posted here:
https://attend.ieee.org/ssci-2023/ieee-symposium-on-computational-intelligence-for-engineering-solutions-ieee-cies/

We would very much appreciate if you could accept our invitation.

Paper submission will be facilitated through the conference webpage in due course.

Deadline for full paper submission:   July 31, 2023

The IEEE SSCI 2023 co-locates multiple exciting symposia at one single location, providing a unique opportunity to encourage cross-fertilization and collaboration in all areas of CI. The IEEE SSCI 2023 features a large number of keynotes, tutorials, and special sessions.

Please accept our apologies if you receive this call for papers more than once through different channels.

Sincerely,

Michael Beer, Leibniz Universität Hannover / University of Liverpool / Tongji University (beer@irz.uni-hannover.de)
Vladik Kreinovich, The University of Texas at El Paso (vladik@utep.edu)
Rudolf Kruse, Otto von Guericke Universität of Magdeburg (kruse@iws.cs.uni-magdeburg.de)