Dear Colleagues,

Sincere apologies for cross-postings.

Please consider contributing to and/or forwarding to the appropriate groups the following opportunity to submit and publish an original research paper to the 7th International Conference on Soft Computing and its Engineering Applications (icSoftComp2025).

Call for Papers

icSoftComp 2025

7^th International Conference on Soft Computing and its Engineering Applications

Hanoi, Vietnam

December 09-11, 2025

Conference website:

https://www.icsoftcomp.org/

Paper submission link:

https://meteor.springer.com/icSoftComp2025

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Important Notes:

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– The submission deadline is 31/8/2025 (extended).

– icSoftComp 2025 follows a double-blind peer review system.

– Conference proceedings by Springer CCIS Series (Scopus-indexed)

– The conference will be held in a hybrid mode: onsite and online

– Authors of selected papers will be invited to submit extended article versions for a post-conference special issue of peer-reviewed Scopus-indexed journals.

The 7^th International Conference on Soft Computing and its Engineering Applications (icSoftComp 2025) aims to provide an excellent international forum for the researchers, academicians, students, and professionals in the areas of computer science and engineering to present their research, knowledge, novel ideas, and innovations. It will exhibit an exciting technical program. It will also feature high-quality tutorials and workshops, industry panels and exhibitions, and keynotes from prominent research and industry leaders.

We are open for technical paper submissions, proposals for workshops/special sessions, and proposals for tutorials.

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Venue:

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Dolce by Wyndham Hanoi Golden Lake Hotel, Hanoi, Vietnam

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Speakers:

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–     Edgar Weippl, University of Vienna, Austria

–        Ahmad Bazzi, New York University Abu Dhabi, UAE

–        Tatiana Kalganova, Brunel University of London, London, UK

–        Massimiliano Cannata, SUPSI, Canobbio, Switzerland

–        Unnati Shah, Utica University, Utica, NY, USA

–        Donatella Firmani, Sapienza University of Rome, Rome, Italy

–        Hong Nhung Nguyen, Gachon University, Seoul, South Korea

–     Dariusz Jacek Jakóbczak, Koszalin University of Technology, Poland

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Indexing:

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Scopus, Google Scholar, DBLP, Ei Compendex, and Springerlink

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Conference series link:

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https://link.springer.com/conference/icsoftcomp

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