December 28th, 2021 
Daniela Lopez de Luise =========================================================
5th INTERNATIONAL WORKSHOP on Data Engineering Meets Intelligent Food & COoking Recipes 2022 – DECOR2022
Co-Located with the 38th IEEE International Conference on Data Engineering (ICDE)
May 9, 2022 – Virtual – KUALA LUMPUR, MALAYSIA
PAPERS SUBMISSION (1st Round):
IMPORTANTE DATE: 14 January 2022, Full and Short Papers, and Demos Submission Deadline.
PUBLICATION: All DECOR 2022 presented papers will be published by ICDE Proceedings at IEEE Xplore
Digital Library and DBLP.
We invite submissions of high-quality papers in all topics of DECOR.
All papers must be original and not simultaneously submitted to another journal or conference and must be prepared for blind review.
Submission@ https://easychair.org/conferences/?conf=decor2022icde
Dear Friends and Colleagues,
DECOR is a premier International Workshop targeting state-of-the-art as well as emerging topics pertaining to researchers in the intersection of Data Engineering, Intelligent Food and Cooking Recipes. As a multidisciplinary conference, it aims at providing an exchange platform for students, faculties, and researchers from all over the world.
DECOR 2022 invites various research associates to discuss the current status, technical challenges, of the future services and applications,
as part of a rich workshop program, which includes
- Keynote Speakers (Academia Track and Industry Track)
- Interactive Panel Discussions
- Enlightening Student session
- Most innovative student paper award Best paper award
The topics of interest include but are not limited to the following (see CFP for expanded topics):
- Foundation and Technologies for Intelligent Food and Cooking Recipes
- Data Analytics in Recipe Computing
- Learning and Deep Learning for Computational Cooking
- Collective intelligence for Recipe Computing
- Nutritional Value and Applications for Intelligent Food Systems
Committee Members
Workshop Chairs
- F. Andres, National Institute of Informatics, JP
- G. Bagler, Indraprashtha Institute of Information and Technology Delhi, IN
- F. Fotouhi, Wayne State University, US
- M. Leite, University of South Florida at St Petersburg, USA/ BCAM, Spain
Publicity Chairs
- R. Kannan, Bishop Heber College, IN
- M. S. Karim, Universiti Putra Malaysia, MY
- A. Pester, The British University in Egypt, EG
- Y. Sulema, Igor Sikorsky Kyiv Polytechnic Institute, UA
- B. Thuraisingham, UT Dallas, US
Program Committee
- C. Anantaram, IIIT & Tata Consultancy Services Ltd, IN
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M. Bhardwaj, Halliburton, US
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A. Cardoso, Universidade de Coimbra, PT
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X. Dai, Univ. of N. Carolina, USA
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L. D’Orazio, IRISA, FR
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G. Ghinea, Brunel University, UK
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I. Ide, Nagoya University, JP
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M.S. Karim, Universiity Putra Malaysia, MY
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D.L. Lee, HKUST, HK
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F. Ofli, QCR Institute, Qatar
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M.T. Restivo, University of Porto, PT
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E. B. Saleme, IFES, BR
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F. Sedes, IRIT, Toulouse, FR
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A. Shakya, Tribhuvan University, Nepal
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C. Shimizu, Kansas State University, US
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Y. Wang, Texas Southern University, US
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K. Yanai, UEC, JP
Steering Committee
- Hevner, A., University of South Florida, US
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Ioannidis, Y., University of Athens, GR
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Kapetanios, E., University of Hertfordshire, UK
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Kitagawa, T., Rakuten, JP
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Levy, P. A., University of Ottawa, CA
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Nuessli Guth., J., ETH Zürich, CH
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Thuraisingham, B., University of Texas Dallas, US
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Yamakata, Y., The University of Tokyo, JP
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Zhang, A., University of Virginia, US
Maria C.A. Leite, PhD
Associate Professor of Mathematics
Phone: 727.873.4801
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