*CALL FOR PAPERS*
Symposium on “Intelligence for Embedded and Cyber-physical Systems” (IntECS 2015)
at IEEE Symposium Series in Computational Intelligence 2015
7 – 10 December 2015, Cape Town, South Africa ( http://ieee-ssci.org.za/)
IntECS 2015 Web site: http://ies.deib.polimi. it/events/intecs-2015-ieee- ssci/
****************************** ****************************
IMPORTANT DATES
Paper submission: June 14, 2015
Author notifications: September 4, 2015
Camera-ready submission: October 4, 2015
Early registration: October 4, 2015
Conference Dates: December 7 – 10, 2015
****************************** *****************************
In recent years, there has been an increasing interest in designing embedded and cyber-physical systems featuring intelligent skills. Beside addressing the specific tasks they have been designed for, these systems are expected, for example, to autonomously make decisions/activate reactions, perform self-diagnosis, and learn from and interact with the operating environment.
This symposium addresses novel and emerging computational-intelligence and machine-learning solutions to provide such an intelligent behavior to embedded and cyberphisical systems. IntECS aspires at providing a forum for researchers who are actively working on intelligent embedded and cyberphisical systems and, more in general, on computational intelligent solutions for real world applications.
The symposium will be held within the IEEE 2015 Symposium Series in Computational Intelligence (7 – 10 Dec. 2015, Cape Town, South Africa)
*Topics*
. Intelligence for embedded systems
. Intelligence for cyber-physical systems
. Cognitive fault-diagnosis systems
. Smart objects and Internet of Things
. Intelligent sensor networks
. Intelligent sensors and robotics
. Intelligent measurement systems
. Adaptive solutions to operate in evolving/changing environments
. Intelligent systems for real-world applications
. Computational intelligence techniques for smart buildings and critical-infrastructure monitoring
*Keywords*
Embedded systems, cyber-physical systems, fault-diagnosis systems, intelligent applications, intelligent sensors, intelligent sensor networks, Computational Intelligence, Internet of Things.
*Symposium Organizers*
– Cesare Alippi (Politecnico di Milano, Dipartimento di Elettronica, Informazione e Bioingegneria, Italy)cesare.alippi@polimi.it
– Giacomo Boracchi (Politecnico di Milano, Dipartimento di Elettronica, Informazione e Bioingegneria, Italy) giacomo.boracchi@polimi.it
– Manuel Roveri (Politecnico di Milano, Dipartimento di Elettronica, Informazione e Bioingegneria, Italy)manuel.roveri@polimi.it
*Technical Program Committee*
Demetrios Eliadis, KIOS Research Center, Cyprus
Stavros Ntalampiras, Politecnico di Milano, Italy
Maurizio Bocca, Bosch Research and Technology Center, CA (USA)
Michalis Michaelidis, Cyprus University of Technology, Cyprus
Huajin Tang, A*STAR, Singapore
Joe-Air Jiang, National Taiwan University, Taiwan
Stefano Squartini, Università Politecnica delle Marche, Italy
Rami Abielmona, Larus Technologies, Canada
Dongbin Zhao, University of Chinese Academy of Science, China
Guillerme DeSouza, University of Missouri-Columbia, USA
Ana-Maria Cretu, Université du Québec en Outaouais, Canada
Vicenç Puig, Universitat Politècnica de Catalunya, Spain
Vicenç Puig, Universitat Politècnica de Catalunya, Spain
*Paper Submission Procedure*
Submissions must contain original, high quality, not submitted or elsewhere published work. Authors must submit their paper through the IEEE SSCI 2015 webpage http://ieee-ssci.org. za/
Accepted papers will be included in the IEEE SSCI 2015 proceedings and indexed through IEEExplore.
Further information and Paper submission can be found at the IEEE SSCI 2015 webpage http://ieee-ssci.org. za/
****************************** *****************************
The call for papers as well as more detailed information can be retrieved from IntECS 2015 webpage
and from the main SSCI 2015 webpage
Please make sure you select:
“Intelligence for Cyber-physical and Embedded Systems” (IntECS 2015) during the submission process
****************************** *****************************