Dear Colleagues and Researchers Worldwide,

We are thrilled to invite you to submit your original research to HRFEST 2026: International Conference on Humanoid Robotics, Innovation & Leadership. Evolving from a highly successful festival format into a truly global academic congress, we proudly invite researchers from all continents to submit their original articles. While our core mission is to reduce the technological gap in Latin America, we achieve this by building an elite, worldwide platform that fosters international collaboration among researchers, professionals, and students.

The conference will take place November 5–7, 2026, hosted at the Universidad Nacional del Callao (UNAC) in Peru.

 Why HRFEST 2026 Stands Out for Global Researchers

We know you receive many conference invitations. Here is what makes HRFEST 2026 uniquely accessible and valuable for your academic growth:

• 100% Free Registration & Full Access: Attendance for the public and international delegations is completely free (subject to capacity via registration). This grants you unrestricted access to all core activities, including keynote conferences, poster sessions, the exclusive Humanoid Showcase, and the open-air ExpoTech fair.

• Zero-Cost Submission & Highly Competitive Rates: The initial submission of your article for peer review is completely free. To democratize science, we offer some of the most accessible indexation rates worldwide, which are only paid if your paper is scientifically accepted.

• The ARLIT Networking Hub: Are you a researcher in Business, Social Sciences, or Healthcare with a great research problem but lacking a technical engineering partner? We offer the ARLIT Call for Paper Networking platform. This free service connects you with engineers to form multidisciplinary teams and co-author papers that meet strict technical standards.

• Global Indexing: We have the official technical backing of global IEEE (Conference Record #71784) and IEEE Region 9. All accepted papers will be published in the IEEE Xplore digital library and submitted for Scopus indexation.

 Accepted Paper Types & Methodologies

As outlined in our research criteria, we welcome diverse approaches across multiple disciplines, provided they align with our structural requirements:

1. Experimental Research (Data, testing, field, results):

• Purely Technical (Robotics, AI, etc.): Accepted.

• Social Sciences / Management (Health, Administration, etc.): Accepted, provided there is a clear and explicit technological contribution.

2. Review Articles (State of the art, systematic reviews):

• Purely Technical: Accepted (as a Proposal).

• Social Sciences / Management: Accepted, provided there is a clear and explicit technological contribution.

Main Technical Tracks:

• Track 1: Robotics and Advanced Manufacturing.

• Track 2: Artificial Intelligence and Data Science.

• Track 3: Engineering Management (Tech Management).

• Track 4: Applied Technologies.

 Important Dates (Rolling Reviews)

You only need to submit your paper once during either of our independent submission windows:

• Round 1 (Early Submission) Deadline: July 12, 2026.

• Round 1 Acceptance Notification: August 15, 2026.

• Round 2 (Regular Submission) Deadline: August 23, 2026.

• Round 2 Acceptance Notification: September 15, 2026.

• Camera-Ready Deadline: October 15, 2026.

 Submission Guidelines

All papers must be written strictly in English and formatted using the official double-column IEEE Conference template (US Letter), with a maximum of 6 pages. Initial submissions must be formatted for Double-Blind review (no author names or affiliations).

Submit your manuscript directly through EasyChair:

 [https://easychair.org/conferences/?conf=hrfest2026]

For more details, templates, or to secure your free registration, please visit our official website at https://hrfest.org   or contact the organizing committee at congress@hrfest.org.

We look forward to welcoming you to Peru to shape the future of technology together!

Sincerely,

The HRFEST 2026 Organizing Committee

Universidad Nacional del Callao, Peru 

Technical Co-Sponsors: IEEE & IEEE Region 9