********************************************************************* Berkeley Initiative in Soft Computing (BISC) ********************************************************************* Please circulate this call for paper. Best regards – nik ================ —————————-~********~———————-———- 2018 IEEE World Congress on Computational Intelligence Windsor Convention Centre, Rio de Janeiro, BRAZIL 08-13 July 2018 www.ieee-wcci.org —————————–~********~——————————– On behalf of the IEEE WCCI 2018 Organizing Committee, it is our great pleasure to invite […]
Archive for the ‘Congress’ Category
IJERA Journal is UGC Approved Journal
June 23rd, 2017
Daniela Lopez de Luise ISSN : 2248-9622 (Online) International Journal of Engineering Research and Applications (IJERA) is ISO 3297:2007 certified open access and peer reviewed refereed international Journal.IJERA invites articles that illustrate research results, projects, surveying works and industrial experiences that describe significant advances in the areas of Engineering, Technology, Science and Mathematics.INDEXING: NASA Ads, ArXiv, ANED (American National Engineering Database), EBSCO Host, Cabell’s Directory, DOAJ, […]
APSAC 2017
June 22nd, 2017
Daniela Lopez de Luise 2nd International Conference on: Applied Physics, System Science and Computers Dubrovnik, Croatia, September 27-29, 2017 www.apsac.co Publisher: ————— The Proceedings of APSAC 2017 will be published by Springer Verlag and they will be indexed in ISI, Scopus, EI-Compendex, MetaPress, SpringerLink, Scholar-Google,… The Proceedings of 2016 have been published by Springer Verlag http://www.springer.com/gp/book/9783319539331 and they are […]
INTERNATIONAL INVENTION JOURNAL OF MEDICINE AND MEDICAL SCIENCES
June 22nd, 2017
Daniela Lopez de Luise International Invention Journal of Medicine and Medical Sciences (IIJMMS) is inviting you to submit your papers in all field of medicine and medical science to be published in her July 2017 issue that will be out shortly. Kindly send your manuscript as a Microsoft Word File via e-mail attachment to the editorial office at: iijmms@internationalinventjournals.org […]




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