Call For Papers – Robotics and Autonomous Systems Journal

December 17th, 2019 Daniela Lopez de Luise

Special Issue: “Autonomous Driving and Driver Assistance Systems”

Robotics and Autonomous Systems Journal

Objectives and Topics

With the recent interest of all major players in the automotive industry, the time when intelligent vehicles begin to drive autonomously seems to be right around the corner. This implies a boost in the development on novel algorithms, techniques and methodologies with direct application not only to Autonomous Driving but also to advanced Driver Assistance Systems. This is the 3rd. edition of this special issue and will cover all these advances. The expected topics include, but are not limited to the following:

  • Vision, lidar and radar perception;
  • Sensor calibration-Multimodal sensor fusion;
  • Perception in challenging conditions;
  • Scene understanding;
  • Software architectures for autonomous vehicles;
  • Special sensors for autonomous navigation;
  • Driver-vehicle interaction and assisted driving;
  • Navigation, motion planning and maneuvering;
  • Vehicle dynamics and control;
  • Outdoors SLAM and Visual Odometry;
  • Heads up Display for Vehicle to Driver Communication;
  • Augmented Reality in DAS-V2V and V2I communications.

Timeline:

Submission deadline: January 15, 2020

Final decision notification: June 1, 2020

Submission:

Authors are invited to submit their work to this Special Issue following the guidelines found in
https://www.elsevier.com/journals/robotics-and-autonomous-systems/0921-8890/guide-for-authors.

To ensure that all manuscripts are correctly identified for inclusion into the special issue, it is important that authors select “VSI: Autonomous Driving & DAS 2020” when they reach the “Article Type Name” step in the submission process.

Special Issue Editors:

Vitor Santos, Universidade de Aveiro, Portugal

Angel Sappa, ESPOL Polytechnic University, Ecuador and Computer Vision Center, Barcelona, Spain

Miguel Oliveira, Universidade de Aveiro, Portugal

Arturo de la Escalera, Universidad Carlos III de Madrid, Spain

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Special Issue “Applications of Artificial Intelligence for Connected & Automated Vehicle”

December 17th, 2019 Daniela Lopez de Luise

SI Web Page: https://www.mdpi.com/si/35928

Deadline: June 1, 2020

 

Applied Sciences journal (Appl. Sci. – ISSN 2076-3417 – IF 2.217) is currently running a special issue titled "Artificial Intelligence for Connected and Automated Vehicles".

 

Special Issue Information

 

Dear Colleagues,
Connected and automated vehicles (CAVs) will provide greater transport convenience and interconnectivity, increase mobility options for young and elderly people, and reduce traffic accidents, congestion and emissions by exploiting Artificial Intelligence and communication technologies. At the same time, major barriers towards the public deployment of CAVs and the realization of smart cities exist, including the safety evaluation and validation of Artificial Intelligence-based vehicle functions. This Special Issue aims to bring together recent advances in methods and tools in the areas of deep learning, knowledge discovery and forecasting, as well as testing and validation, to make connected and automated vehicles efficient and safe. Particularly, we invite contributions that identify and provide insight into the limitations of Artificial Intelligence-based functions for connected and automated vehicles and/or advance the state of the art by breaking existing limitations.

 

Manuscript Submission Information

 

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

 

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

 

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1500 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

 

Keywords

·        Deep Learning

·        Deep Neural Networks

·        Connected Vehicles

·        Automated Vehicles

·        Big Data

·        Smart Cities

 

Prof. Dr. Stratis Kanarachos

Prof. Dr. Aristotelis Naniopoulos

Dr. Dimitrios Nalmpantis

Dr. Vasile Palade

Guest Editors

________________

Dimitrios Nalmpantis

PhD (Transp.), MA (Hum.), MBA (Exec.), MEng (Civ.)

Laboratory Teaching Faculty AUTh

Transport Engineering Laboratory, Division of Transport and Project Management,

School of Civil Engineering, Faculty of Engineering, Aristotle University of Thessaloniki (AUTh)

p: PO Box 452, 541 24 Thessaloniki, Greece

t: +302310995811

f: +302310995789

s: Dimitrios.Nalmpantis

e: dnalba@civil.auth.gr


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Call For Papers- Journal of Real Time Image Processing

December 12th, 2019 Daniela Lopez de Luise

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  • Paper submission due: March 31, 2020
  • First notification: May 31, 2020
  • Revision submission due: July 15, 2020
  • Final decision: September 30, 2020
  • Publication date: October 2020 (Tentative)
    • Note: accepted papers are made available online soon after acceptance.
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    RFIW2020 @ FG: 2 New Tracks open now + Deadline pushed to 01/20/2020! {CFP}

    December 12th, 2019 Daniela Lopez de Luise

     

    IEEE international workshop on in conjunction with 2020 FG

    4th Data Challenge Workshop on Recognizing Families In the Wild (RFIW)
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    Conference on Higher Education Advances (Valencia, Spain)

    December 12th, 2019 Daniela Lopez de Luise

    HEAd'20: Call for Papers

    6th International Conference on Higher Education Advances

    June 2 – 5, 2020. Valencia, Spain
    http://www.headconf.org
    twitter: @headconf

    Scope

    After the great success of the previous HEAd conferences, which received submissions from more than 50 countries, we are pleased to announce the Sixth International Conference on Higher Education Advances (HEAd'20). This conference is an excellent forum for researchers and practitioners to exchange ideas, experiences, opinions and research results relating to the preparation of students, teaching/learning methodologies and the organization of educational systems.

    The HEAd'20 conference will be held on June 2-5, 2020 at the Faculty of Business Administration and Management of the Universitat Politecnica de Valencia (UPV), which has been recently ranked as the best technical university in Spain by the Academic Ranking of World Universities (ARWU) 2019.

    Topics of interest

    The program committee encourages the submission of articles that communicate applied and empirical findings of interest to higher education professionals.

    Topics of interest include, but are not limited to, the following topic areas:

    • Innovative materials and new tools for teaching
    • Educational technology (e.g., virtual labs, e-learning)
    • Evaluation and assessment of student learning
    • Emerging technologies in learning (e.g., MOOC, OER, gamification)
    • Scientific and research education
    • Experiences outside the classroom (e.g., practicums, mobility)
    • New teaching/learning theories and models
    • Globalization in education and education reforms
    • Education economics
    • Teaching and learning experiences
    • Entrepreneurship and learning for employment
    • Education accreditation, quality and assessment
    • Competency-based learning and skill assessment

    Important Dates

    Submission deadline: January 24, 2020
    Author notification: March 25, 2020
    Camera ready due: April 13, 2020
    Conference dates: June 2-5, 2020

    Publications

    All accepted papers will appear in the conference proceedings with a DOI and ISBN number. They will be published in open access by UPV Press and submitted to be indexed in major international bibliographic databases. The first three editions are already indexed in the Thomson-Reuters Conference Proceedings Citation Index – Web of Science Core Collection (former ISI Proceedings).

    Awards

    The Program Committee will select the winners for the Best Paper and Best Student Paper awards. To be eligible for the best student paper award, the presenting author of the paper must be a full-time student.

    Submission guidelines

    Authors from all over the world are invited to submit original and unpublished papers, which are not under review in any other conference or journal. All papers will be peer reviewed by the program committee based on their originality, significance, methodological soundness, and clarity of exposition.

    Submitted papers must be written in English and should be in PDF format. They must follow the instructions in the template file, available in Microsoft Word format at:

    http://www.headconf.org/template.docx

    Paper length must be between 4 and 8 pages, incorporating all text, references, figures and tables. Submissions imply the willingness of at least one author to register, attend the conference, and present the paper.

    HEAd'20 is using the OCS platform of UPV Press to manage the submissions. This platform provides you with a submissions homepage where you can register your paper submission and make appropriate changes. The submission website is:

    http://www.headconf.org/submission-instructions/

    About the venue

    Valencia is the third largest city in Spain and is located on the shore of the Mediterranean Sea. It embraces culture and tradition from the past combined with singular architecture, exciting gastronomy, nightlife, and beautiful white sand beaches. Valencia is the capital city of the Comunitat Valenciana region, which is major tourist destination in summer. More info at:

    http://www.headconf.org/venue/about-valencia/

    The organizing committee looks forward to welcoming you all to a fruitful conference with open discussions and important networking to promote high quality education.

    If you do not wish to receive any further communication please unsubscribe at: http://www.headconf.org/u.php?u=daniela_ldl$ieee.org

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