LAMC-2018 is the Second IEEE MTT-S Latin America Microwave Conference (LAMC), to be held in Arequipa, Peru, in December 12-14, 2018 (www.lamc-ieee.org). LAMC is an international forum dedicated to in-depth scientific and technological discussions on a broad set of fields related to RF and microwave devices, circuits, and systems.

Prospective authors are cordially invited to submit original contributions to LAMC-2018, which includes, but is not limited to, the following topics:

1.     Passive Components, Circuits and Devices: planar and non-planar components, circuits, filters and multiplexers; tunable devices (passive components, filters and multiplexers); metamaterials-based components and devices, frequency selective surfaces (FSSS), and electromagnetic band gaps (EBGs).

2.     Active Devices, Circuits and Subsystems: RF integrated circuits (RFICs), microwave monolithic integrated circuits (MMICs); power amplifiers, linearization techniques, digital pre-distortion and low-noise circuits; signal generation, conversion and control modules; linear and non-linear modeling and characterization.

3.     RF Systems and Applications: microwave systems and front-ends; industrial, scientific and medical applications; navigation systems and intelligent transportation systems; RFID systems and applications; mm-wave and THz technologies and systems, applications (imaging, etc.); sensors, wireless power transmission, energy harvesting.

4.     Communication Systems and Applications: terrestrial and vehicular applications; satellite communication systems and applications; wireless and cellular communication systems, indoor and outdoor applications.

5.     Antennas: phased arrays (active or passive, related circuits, Tx/Rx modules); integrated antennas, active and/or reconfigurable (smart) antennas; digital-beam forming (spatial power combination, multiple-beam scanning), MIMO.

6.     Signal-Power Integrity and High-Speed Digital Techniques: EM interference and compatibility; high-speed interconnects; equalization and post-silicon validation techniques; power delivery networks; computer simulations and measurements.

7.     CAD Techniques for RF and Microwave Engineering: surrogate-based modeling and optimization, space mapping-based methods; model order reduction techniques, statistical analysis and design; EM-based and multiphysics design optimization; EM field theory, time- and frequency-domain numerical techniques.

Important Dates
Proposals for special sessions and tutorials: July 09, 2018
Paper submission: August 06, 2019
Notification of acceptance: October 08, 2018
Accepted papers final submission: November 08, 2018
Conference dates: December 12-14, 2018

All accepted and presented papers will be published in the LAMC Conference Proceedings and submitted for inclusion in the IEEE Xplore Digital Library.

LAMC will use IEEE EDAS as the electronic paper management system. Detailed instructions on how to submit your paper are given at https://lamc-ieee.org/authors-organizers/call-for-papers

Confirmed Keynote Speakers:
Dr. Patrick Roblin
Dra. Zoya Popovic
Dr. Mike Golio

Main Organizing Committee:

General Chair
Guillermo Rafael-Valdivia, Universidad Católica San Pablo, Arequipa, Peru. grafaelv@ucsp.edu.pe

General Co-Chair           
Dr. Patrick Roblin, The Ohio State University, roblin.1@osu.edu

Technical Program Committee Chair     
Dr. Efrain Zenteno-Bolaños, Universidad Católica San Pablo, ezenteno@ucsp.edu.pe

Technical Program Committee Co-Chair              
Dr. Emmanouil Tentzeris, Georgia Tech, Atlanta,  etentze@ece.gatech.edu

Financial Chair  (treasurer)
Dr. Efrain Mayhua-Lopez, Universidad Católica San Pablo, emayhua@ucsp.edu.pe

Exhibition Chair
Ing. Agustin Vijande, AQTK, agustinvijande@aqtk.com.pe

Please accept our apologies if you receive multiple copies of this message.

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