TThe 3rd International Conference on Advance Materials Research and Application (AMRA 2016)

The 3rd International Conference on Advance Materials Research
and Application (AMRA 2016)

http://www.amraconf.org/
December 18-21, 2016     Guangzhou, China.

Conference Introduction

The 3rd International Conference on Advance Materials Research and Application (AMRA 2016) will be held from December 18-21, 2016, in Guangzhou, China. The main objective of AMRA 2016 is to provide a comprehensive global forum for experts and participants from academia to exchange ideas and present results of material research and application. The conference proceedings will be published by Materials Science Forum (ISSN: 1662-9752) indexed by Ei Compendex, SCOPUS, Google Scholar, Inspec, ProQuest, EBSCO. Click here to submit: http://www.amraconf.org/2016/papersub/Author/Login.aspx.

Technical Program Committee (TPC)

AMRA 2016 is inviting scholars and experts in the field of advance material research to consider serving as Technical Program Committee (TPC) member. If you are interested in serving as TPC member or you would like to recommend someone, please send CV to amra2016@126.com.
TPC’s name, affiliation and nationality will be shown on the webpage and proceedings.

Important Dates
Full Paper Submission Due:
May 26, 2016
Acceptance/Rejection Notification Date:
Six weeks after submission
Abstract of attendee submission Due:
November 20, 2016
Conference Date:
December 18-21, 2016

Tour
Organizing Committee will arrange a tour in Guangzhou after conference.

Contact Us
Email: amra2016@126.com
Tel: 0086—15623060563

Topics include but are not limited to the following areas:
Metals and Alloy materials
Energy materials
Nanomaterials
Environmental coordination materials
Biomedical Materials
Polymer and composite materials
Ceramic materials and properties
Functional materials
Microelectronic materials
Materials chemistry and physics
Synthesis and processing
Thin film growth process and properties
Surface treatment
Construction materials
Other areas related to material science

The 3rd International Conference on Behavioral, Economic, and Socio-Cultural Computing

The 3rd International Conference on Behavioral, Economic, and Socio-Cultural
Computing 

URL: http://besc-conf.org/2016
Submission System: https://easychair.org/conferences?conf=besc2016

All accepted conference papers will be submitted for inclusion into IEEE
Xplore as well as other Abstracting and Indexing (A&I), e.g. EI and DBLP.
Top quality papers after presented in the conference will be selected for
extension and publication in several special issues of international
journals, e.g., World Wide Web Journal (Springer) and Social Network
Analysis and Mining (Springer).

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Important Dates
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Paper Submission Due:      01/07/2016
Author Notification Due:   15/08/2016
Camera Ready Due:          01/09/2016
Conference date:           11-13/11/2016

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Conference Scope
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The 3rd International Conference on Behavioral, Economic, and Socio-Cultural
Computing (BESC2016) will take place in Hilton Gardon Inn, South Point,
Durham, NC, USA, 11-13 November, 2016. 

BESC aims to become a premier forum in which academic researchers and
industry practitioners from data mining, artificial intelligence, statistics
and analytics, business and marketing, finance and politics, and behavioral,
economic, social and psychological sciences could present updated research
efforts and progresses on foundational and emerging interdisciplinary topics
of BESC, exchange new ideas and identify future research directions. 

All accepted conference papers will be submitted for inclusion into IEEE
Xplore as well as other Abstracting and Indexing (A&I), e.g. EI and DBLP.
Top quality papers after presented in the conference will be selected for
extension and publication in several special issues of international
journals, e.g., World Wide Web Journal (Springer) and Social Network
Analysis and Mining (Springer).. The conference committee invites
submissions of applied or theoretical research and application-oriented
papers on any below areas/tracks.

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Topics of Interest
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Papers are invited in the areas below, but do not exclude research in the
general areas of the topic headings.

(1) Social Computing and Applications
 – Social behavior
 – Social network analysis
 – Semantic web
 – Collective intelligence
 – Security, privacy, trust in social contexts
 – Social commerce and related applications
 – Social recommendation
 – Social data mining

(2) Behavioral and Economic Computing
– Agent-based modeling
– Artificial/experimental markets
– Asset pricing
– Computational finance
– Financial crises
– Monetary policy
– Optimization
– Volatility modeling
– Evolutionary economics

(3) Information Management and Systems 
 – Decision Analytics
 – E-Business
 – Societal impacts of IS
 – Human behavior and IS
 – IS in healthcare
 – IS security and privacy
 – IS strategy, structure and organizational impacts
 – Service science and IS

(4) Digital Humanities
 – Digital media
 – Digital humanities
 – Digital games and learning
 – Digital footprints and privacy
 – Twitter histories creation
 – Crowd dynamics
 – Digital arts
 – Digital healthcare
 – Mobile technologies
 – Activity streams and experience design

(5) User Modeling, Privacy, and Ethics
 – Personalization for individuals, groups and populations
 – Large scale personalization, adaptation and recommendation
 – Web dynamics and personalization
 – Privacy, perceived security and trust

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Paper Submissions
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All papers will be reviewed by the Program Committee on the basis of
technical quality, relevance to BESC 2016, originality, significance and
clarity. Please note:

 – All submissions should use IEEE two-column style. Templates are available
fromhttp://www.ieee.org/conferences_events/conferences/publishing/templates.htm
l
 – All papers must be submitted electronically through the paper submission
system in PDF format only, BESC2016 accepts scientific papers (6 pages),
short papers (2 pages) and demo papers (2 pages).
 – Submitted papers must not substantially overlap with papers that have
been published or that are simultaneously submitted to a journal or a
conference with proceedings.
 – Papers must be clearly submitted in English and will be selected based on
their originality, timeliness, significance, relevance, and clarity of
presentation.
 – Submission of a paper should be regarded as a commitment that, should the
paper be accepted, at least one of the authors will register and attend the
conference to present the work.

Paper submission system is available at:
https://easychair.org/conferences/?conf=besc2016

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Organizers
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General Chair
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 – Paul Wang, Duke University, USA

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Conference Chair
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 – Leon S.L. Wang, National University of Kaohsiung, Taiwan

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Program Committee Co-chairs
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 – Gang Li, Deakin University, Australia
 – Yves Demazeau, CNRS, France

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Sponsorship Chair
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 – Guandong Xu, University of Technology Sydney, Australia

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Track Chairs
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Social Computing and Applications: 
 – Jaroslaw Kozlak, University of Science and Technology, Cracow, Poland

Behavioral and Economic Computing: 
 – Herbert Dawid, Bielefeld University, Germany

Information Management and Systems: 
 – Wu HE, Old Dominion University, USA

Digital Humanities: 
 – JianBo Gao, Guangxi University, China
 – Ziqian Dong, NYIT, USA
 – Yang Zhao, Nanyang Technological University, Singapore
 – Changxiu Cheng, Beijing Normal University, China 

User Modeling, Privacy, and Ethics:
 – Yidong Li, Beijing Jiaotong University, China

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Industry Chair
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 – Alvin Chin, BMW Group, USA
 – Xin Li, iFlyTek Research, China

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Special Sesssion Chair
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 – I-HSIEN TING, National University of Kaohsiung, Taiwan

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Publication Chair
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 – Guanfeng Liu, Soochow University, China

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Publicity Chair
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 – Shaowu Liu, Deakin University, Australia
 – Jie Kong, Xi'an Shiyou University, China
 – Frank Jiang, University of Technology Sydney, Australia

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2017 Int.Conf. on Applied Mathematics and Computer Science, Rome, Italy, January 27-29

2017 Int.Conf. on Applied Mathematics and Computer Science, Rome, Italy, January 27-29,

http://www.icamcs.net

ICAMCS:  The 2017 International Conference on Applied Mathematics and Computer Science
(ICAMCS) will be held in Rome, Italy during January 27-29, 2017 and will be composed by
Special Sessions and Symposia. ICAMCS aims to be the leading international conference for
presenting novel and fundamental advancements in the fields of Applied Mathematics and
Computer Science. ICAMCS features invited keynotes as well as peer-reviewed paper
presentations. Submissions will be peer reviewed and evaluated based on originality,
relevance to conference, contributions, and presentation.

Topics
——
The main objective of the Conference is to provide a platform for researchers, engineers,
academicians as well as industrial professionals from all over the world to present their
research results and development activities in Mathematical Methods and Computational
Techniques as well as their applications in various sciences and in industry.
Only full papers will be promoted to reviewers for thorough peer review.

Proceedings will be published by AIP (American Institute of Physics) with perpetual Open
Access. The American Institute of Physics (AIP) Conference Series is a reputable series
of Proceedings indexed in the major citation indexe: ISI, SCOPUS,  EI Compendex, Inspec
(IET) , MathSciNet, Scirus,  Google Scholar etc….

ICAMCS 2017

45 JAIIO, Jornadas Argentina de Informática


Latin American Symposium of Software Engineering (SLISW-CLEI 2016)

Latin American Symposium of Software Engineering (SLISW-CLEI 2016)

October 10-14 2016,
Valparaiso-Chile.
www.clei.org/clei2016

IMPORTANT DATES

Abstract submission deadline: May 8, 2016
Paper submission deadline: May 15, 2016
Notification of acceptance: July 12, 2016
Final version submission: August 16, 2016

TOPICS:

Security, Safety, Privacy and Risk Management
Product and Process Software Quality
Software Measurement
Architecture, Frameworks and Design Patterns
Requirements Engineering
Software Engineering  for self-adaptive systems
Maintenance and Reverse Engineering
Verification, Validation and Testing
Component-based development and Reuse
Tools and emerging Applications
Collaborative, Distributed, Concurrent, Embedded, Real-time, high performance, Smart, and Multimedia systems
Human-Computer Interaction
Model-Driven development
Software Product Lines
Agile Software Development
Global Software Development
Ubiquitous and mobile systems
Web-based Software
Empirical studies, Benchmarking and Best Practices Industrial
Mining software engineering repositories

INFORMATION FOR PAPER SUBMISSION

Articles can be written in Spanish, Portuguese or English, and should be
sent in PDF format prior to May 15, 2016  by using the JEMS
platform(https://jems.sbc.org.br/home.cgi?c=2529).

* Submitted papers must present original research results or relevant
experience reports, and should not be published or under evaluation for
other conferences and/or journals. An article can be sent to only one
symposium or associated event.

* Submissions should not exceed 12 pages, including figures, references
and an abstract of 150 words in some official language of CLEI 2016
(English, Spanish, or Portuguese). All submissions must have an abstract
in English, and must be formatted according to the IEEE standard
referenced in the CLEI 2016 website.

* Submitted papers must be substantial intellectual contributions of the
authors, and follow nti-plagiarism practices set out in the CLEI Authors
Behavior Code
(www.clei.org/index.php/reglamento/codigo-de-conducta-para-autores-clei).

* The final program and the proceedings will only include papers with at
least one author registered in the AUTHOR category of the conference
before final version submission deadline.

* A selection of the best papers presented at the CLEI 2016 symposium
will be fast-tracked for publication in selected journals, including the
CLEI Electronic Journal (www.clei.org/cleiej) and Electronic Notes in
Theoretical Computer Science (www.entcs.org). Authors of invited
articles must submit a version, in English and improved and expanded (at
least 30%), to undergo the journal evaluation process.

* Articles accepted and presented at the symposium of CLEI 2016 will be
indexed and published by IEEE Xplorer digital library. No-shows will not
be published; presentation by non-authors must be authorized
case-by-case by the general program chairs.

CHAIRS

Ricardo Gacitúa, UFRO, Chile
Nelly Condori-Fernandez, VU University Amsterdam, The Netherlands

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