IEEE Technically Sponsored SAI Intelligent Systems Conference 2016 IntelliSys 2016

IEEE Technically Sponsored SAI Intelligent Systems Conference 2016
IntelliSys 2016
20-22 September 2016
London, UK
We invite you to submit your papers/posters/demo proposals for the IntelliSys 2016 Conference to be held from 20-22 September 2016 in London, UK, technically sponsored by IEEE.
This conference will focus in areas of intelligent systems and artificial intelligence and how it applies to the real world. It is an opportunity for researchers in this field to meet and discuss solutions, scientific results, and methods in solving intriguing problems in this field.The conference programme will include paper presentations, poster sessions and project demonstrations, along with prominent keynote speakers and industrial workshops.
All submitted papers will be reviewed by experts in the field based on the criteria of originality, significance, quality and clarity. Previous sponsors and partners include HERE, HPCC Systems, Nvidia, Siemens, BigML, IEEE and many more.
Call for Papers – Early Bird Submission
Paper Submission Due : 15 February 2016
Acceptance Notification : 15 March 2016
Author Registration : 01 April 2016
Camera Ready Submission : 01 May 2016
Call for Papers – Regular Submission
Paper Submission Due : 01 March 2016
Acceptance Notification : 01 April 2016
Author Registration : 01 May 2016
Camera Ready Submission : 01 June 2016
Conference Topics include but are not limited to Artificial Intelligence, Machine Vision, Image/Video Processing, Machine Learning, Robotics, Smart Buildings and Cities, Internet of Things, Security, Biometrics and many more. See full list of topics
All SAI Intelligent Systems Conference 2016 papers will be published in the conference proceedings, submitted to IEEE Xplore and indexed in various international databases like Scopus, Inspec, Google Scholar and more. Past conference proceedings are already indexed in these databases.
Looking forward to your contributions.
Regards,
Professor Liming Chen
Chair
IntelliSys 2016

AMEME2016

Welcome to AMEME2016

2016 International Conference on Applied Mechanics, Electronics and Mechatronics Engineering

May 28-29, 2016, Beijing, China

Publication

All the AMEME2016 accepted papers will be published by World Scientific Publishing and be submitted by World Scientific Publishing for indexing by Thomson Reuters Web of Science CPCI-S (ISTP indexing) and EI Compendex. Excellent papers will be selected and published on SCI and EI journals.

Paper Submssion

Our services

Download the Paper Format: Word Template.doc
Download the Submission Form: Submission Form

Please send your Paper(s) and Submission Formto AMEME2016 via email: ameme2016@163.comThe email subject should be named “Submission“.
Submission Deadline: February 16, 2016

  • Please prepare your paper in MS WORD or PDF format.
  • Authors are invited to submit full papers, short papers in English.
  • .Regular papers are allowed to 6 pages. Extra pages(exceed 6 pages) will incur additional charges.
  • All submissions should be originality, technical quality and will not be published elsewhere

投稿方式

Our news

格式模板下载 Word Template.doc
下载并填写论文登记表: Submission Form

请您将文章和填写好的论文登记表一并发送到会务组邮箱:ameme2016@163.com 邮件主题请标明“投稿”。
咨询电话+86-15071023551
截稿日期:2016年2月16日

  • 本次会议只接收全文投稿,且文章是WORD或PDF文件。
  • 文章的语言必须是英文。
  • 文章篇幅一般为6个版面。如果超过6个版面,会产生超页版面费。
  • 文章不能出现抄袭或一稿多投等现象,一经发现,文责自负。
Copyright © 2016 International Conference on Applied Mechanics, Electronics and Mechatronics Engineering(AMEME2016)

2016 International Seminar on Application of Materials Science and Energy Materials (SAMSE 2016)

2016 International Seminar on Application of Materials Science and Energy Materials (SAMSE 2016)will be held during May 28-29, 2016 in Shanghai, China.

Possessed by a kind of desperation, she adds in the next breath, that she will come to Mr. Jasper in the garden. She shudders at the thought of being shut up with him in the house; but many of its windows command the garden, and she can be seen as well as heard there, and can shriek in the free air and run away. Such is the wild idea that flutters through her mind.

Publications

Materials Science Forum
ISSN Print: 0255-5476
ISSN Web: 1662-9752
Online: http://www.scientific.net/MSF
Indexed by: Ei, CPCI-S(ISTP), SCOPUS, Google Scholar, EBSCO etc.

All accepted papers of SAMSE2016 will be published in the international journal of “Materials Science Forum” which is in the newest EI Source List and will be indexed by Ei, CPCI-S(ISTP), SCOPUS, Google Scholar, EBSCO etc.

SAMSE 2016 has been listed in TTP conference list: http://www.scientific.net/conference-1376

You are welcome to submit your paper(s) by our online submission system . The review result will be sent outin 10 days.

Homepage of this conference: http://www.samse.org
Online Submission System: http://www.samse.org/submission

Important Date
Final Paper submission due: Feb. 25, 2016

Topics of interest for submission include, and are only limited to Materials Science :
  • Glasses
  • Thin Films
  • Composites
  • Iron and Steel
  • Aerospace materials
  • Micro / Nano Materials
  • Ceramic materials
  • Chemical Materials
  • Coatings and surface engineering
  • New Energy Materials
  • Materials forming

For more information , please visit: http://www.samse.org/callForPaper.html

Contact
E-mail: samsem@yeah.net
Phone: +86-13310186519
Secretary: Dr. Zhao

3rd International Conference on Economy and Society (EAS 2016)

EAS 2016

  • The 3rd International Conference on Economy and Society (EAS 2016) will be held from September 17-18, 2016 in Three Gorges, Yichang, China.
  • 第三届经济与社会国际学术会议于2016年9月17日至18日在中国宜昌三峡召开。
  • http://www.as-se.org/conf/eas2016
Published in a Regular Issue
  • Accepted papers will be published accordingly in a regular issue on one of the following journals listed below:
  • 本届会议录用的文章将按照出版社的计划在以下期刊的正刊中发表:
  • Frontiers in Finance(FF)
  • ISSN Print: 2380-1670 ISSN Online: 2380-1689
  • Economic Management Journal (EMJ)
  • ISSN Print: 2169-6020 ISSN Online: 2169-6039
  • Submission Deadline: April 7, 2016
  • Submit Paper http://www.as-se.org/conf/eas2016/papersub/Author/Login.aspx
Call for TPC
  • If you have an interest in being one of TPC members, please send your latest CV to us.
  • 若您有兴趣成为TPC成员,请发送最新的中、英文简历至组委会邮箱,谢谢。
Contact Us

2016 2nd International Conference on Social, Education and Management Engineering

 

2016 2nd International Conference on Social, Education and Management Engineering

March 20-21, 2016, Bangkok, Thailand

www.seme2016.net

Paper Submission Download the Paper Format: Template.doc

Download the Submission Form: Submission Form

Please send us your paper(s) and Submission Form via email:

seme2016@163.com or seme2016@126.com

Submission due date:

February 15, 2016

Publication All the SEME2016 accepted papers will be published by DEStech Publications. DEStech Publications will submit all the papers to be indexed inThomson Reuters Web of Science CPCI-SSH(ISSHP) and CNKI Scholar for worldwide online citation.

Some excellent papers will be selected and recommended to EI or SCI journals.

Topics Topic 1: Social Research;

Topic 2: Education Science and Technology;

Topic 3: Management Science and Engineering;

Topic 4: Business and Economics Management;

Topic 5: Other Related Topics;

See more: http://www.seme2016.net/cfp.htm

Contact us Email: seme2016@163.com

Tel: 0086-13554167216

第二届社会,教育和管理工程国际学术会议(SEME2016)

2016年3月20-21日, 泰国曼谷

www.seme2016.net

会议论文集将由DEStech Publications出版,并由DET出版社提交至CPCI-SSH(ISSHP) and CNKI Scholar检索。优秀文章经扩展后推荐至SCI及EI期刊.

征稿主题:社会研究;教育科学与技术;管理科学与工程;商业经济管理等。

截稿日期20160215

投稿邮箱:seme2016@163.com or seme2016@126.com

会议电话:0086-13554167216

 

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