You are invited to submit your high-quality work to the upcoming ACM CoNEXT 2026.
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December 7-10, 2026 – Utrecht, The Netherlands
Conference website: https://conferences.sigcomm.org/co-next/2026/#!/home
Full CFP: https://conferences.sigcomm.org/co-next/2026/#!/cfp
Submission Guidelines: https://conferences.sigcomm.org/co-next/2026/#!/submission
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CfP: 16th Model-Driven Requirements Engineering (MoDRE) Workshop at RE’26
May 19th, 2026
Daniela Lopez de Luise This will give you almost two more weeks from today to finalize your paper (or write a new one). MoDRE'26 accepts short and long papers:
https://www.modre2026.ece.mcgill.ca/submission.htm
Also, please note that the workshop date has been finalized. The workshop will be held Monday August 17., 2026.
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Call for Papers
16th INT. WORKSHOP ON MODEL-DRIVEN REQUIREMENTS ENGINEERING (MoDRE)
Co-located with the
34th IEEE Int. Requirements Engineering (RE) Conference
August 17 – 21, 2026
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The 16th International Model-Driven Requirements Engineering (MoDRE) workshop continues to provide a forum to discuss the challenges and opportunities of applying Model-Driven Development (MDD) to Requirements Engineering (RE). RE can leverage MDD techniques by balancing flexibility in capturing user needs with the formal rigor required for model transformation. MoDRE aims to explore areas of RE that have not yet been sufficiently formalized for integration into MDD environments, as well as to investigate how RE models can benefit from emerging topics in the model-driven community, including flexible, collaborative, and AI-enabled modeling. In accordance with this year’s RE conference theme, we would like to focus on the impact of large language models (LLMs) and generative AI on model-based requirements engineering techniques. We look forward to identifying new challenges for MoDRE, discussing ongoing work and potential solutions, analyzing the strengths and weaknesses of MDD approaches for RE, fostering stimulating discussions on the topic, and providing opportunities to apply MDD approaches for RE.
https://www.modre2026.ece.mcgill.ca/
IMPORTANT DATES
Extended Abstract Submission: May 25th, 2026
Extended Paper Submission: June 1st, 2026
Author Notification: June 22nd, 2026
Camera Ready Due: July 2nd, 2026
Workshop Date: August 17th, 2026
All deadlines are 23:59:59, Anywhere on Earth (AoE) Standard Time.
For more information, see the complete CFP at
https://www.modre2026.ece.mcgill.ca/cfp.htm
or contact the organizers at modre-info at cs.mcgill.ca.
TOPICS
https://www.modre2026.ece.mcgill.ca/cfp.htm
SUBMISSION AND PROCEEDINGS PUBLICATION
https://www.modre2026.ece.mcgill.ca/submission.htm
ORGANIZING COMMITTEE
Ana Moreira, Universidade Nova de Lisboa, Portugal
Gunter Mussbacher, McGill University, Canada
Joao Araujo, Universidade Nova de Lisboa, Portugal
Pablo Sanchez, Universidad de Cantabria, Spain
Boqi Chen, McGill University, Canada
PROGRAM COMMITTEE
https://www.modre2026.ece.mcgill.ca/committees.htm
CFP QUAMES 2026 – 7th International Workshop on Quality and Measurement of Model-Driven Software Development
May 14th, 2026
Daniela Lopez de Luise
CALL FOR PAPERS
7th International Workshop on Quality and Measurement of Model-Driven Software Development
(QUAMES 2026), https://quames.testar.org
To be held in conjunction with MODELS 2026, Malaga, Spain
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QUAMES aims to attract research on methods, procedures, techniques, and tools for measuring and evaluating the quality of conceptual models that can be used in MDSD environments. Its main objective is to enable the development of high quality software systems by promoting quality assurance from a model-based perspective and by exploring the challenges, benefits and lessons learned from conceptual modelling in AI-generated software.
Topics of interest include (but are not limited to):
– Quality models for conceptual models
– Empirical evaluation of quality models
– Metrics, Measures and Measurement of conceptual models
– Defect detection in conceptual models
– Testing of conceptual models
– Model-based testing
– Case studies, experiments, surveys, and and experience reports on quality and measurement of MDSD projects
– No-Code/Low-Code tools for measuring conceptual models
– Tools for quality evaluation of conceptual models
– Tools for model-based testing
– Quality of conceptual models for ethics and trustworthiness
– AI for conceptual models and conceptual models for AI
– Conceptual models for safety critical systems
– Conceptual models for software quality assurance
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Paper Submission
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Finalized or ongoing research papers concerning the quality, measurement, or testing of models that can be used in MDD environments are welcome for submission.
Accepted papers are planned to be published in the joint workshop proceedings of the MODELS. Papers can be accepted as full papers or short papers, with no more than 10 pages for full papers and no more than 5 pages for short papers.
Submissions to QUAMES 2026 must be formatted according to the ACM formatting guidelines
https://www.acm.org/publications/proceedings-template.
Papers have to be submitted in PDF format using the EasyChair submission page https://easychair.org/conferences/?conf=quames2026, 7th International Workshop on Quality and Measurement of Model-Driven Software Development.
All submissions will be screened by the scientific committee for their appropriateness to the workshop themes and format. Each submission will be reviewed by at least three program committee members. Authors will be guided to fit their presentations to the workshop rules. In case of inconclusive and conflicting review results, internal discussions will be held to decide upon the final acceptance or rejection of a paper.
It is mandatory that at least one author will register and present the paper during the workshop.
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Important Dates
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Abstract deadline: 26-06-2026
Submission deadline: 03-07-2026
Authors Notification: 30-07-2026
Camera-ready deadline: 21-08-2026
Workshop will take place on October 4-6, 2026
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Organizing Committee
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Beatriz Marin – Universitat Politecnica de Valencia, Spain, <a href="mailto:bmarin@dsic.upv.es" title="mailto:bmarin@dsic.upv.es” style=”border:0px;font:inherit;margin:0px;padding:0px;vertical-align:baseline;color:rgb(70,120,134);text-decoration:underline” target=”_blank”>bmarin@dsic.upv.es
Clara Ayora – Universidad Castilla-La Mancha, Spain, <a href="mailto:clara.ayora@uclm.es" title="mailto:clara.ayora@uclm.es” style=”border:0px;font:inherit;margin:0px;padding:0px;vertical-align:baseline;color:rgb(70,120,134);text-decoration:underline” target=”_blank”>clara.ayora@uclm.es
Marcela Ruiz – Zurich University of Applied Sciences, Switzerland, <a href="mailto:marcela.ruiz@zhaw.ch" title="mailto:marcela.ruiz@zhaw.ch” style=”border:0px;font:inherit;margin:0px;padding:0px;vertical-align:baseline;color:rgb(70,120,134);text-decoration:underline” target=”_blank”>marcela.ruiz@zhaw.ch
IEEE Industry Webinar & Panel Series 2026 | IEEE IEC Region 9
May 14th, 2026
Daniela Lopez de Luise 
To view complete details for this event, click here to view the announcement
IEEE Industry Webinar & Panel Series 2026 | IEEE IEC Region 9
IEEE Industry Webinar & Panel Series 2026 | IEC Region 9
El IEEE Industry Engagement Committee (IEC) Región 9 invita a estudiantes, jóvenes profesionales, investigadores y líderes de la industria de toda Latinoamérica a participar en el IEEE Industry Webinar & Panel Series 2026.
Este evento virtual internacional reunirá a destacados profesionales de Argentina, México, Honduras, España y Estados Unidos en una jornada completa de webinars técnicos y paneles orientados a la industria. Cada sesión ha sido diseñada para compartir experiencias reales, aplicaciones prácticas y tendencias tecnológicas que están transformando actualmente el sector industrial y tecnológico.
Los participantes tendrán la oportunidad de aprender directamente de expertos que trabajan activamente en áreas de investigación, desarrollo, consultoría, operación e innovación tecnológica.
Temáticas del Evento
- Inteligencia Artificial y Ciencia de Datos
- Redes Inteligentes y Conectividad Global
- Diseño Electrónico Automotriz
- Conductores de Alto Desempeño Térmico
- Load Shedding y resiliencia de sistemas eléctricos
- DevOps & MLOps aplicados a entornos reales
- Metrología para la industria de semiconductores
- Ética e integridad en la ingeniería
Información General
📅 Fecha: Sábado 16 de mayo de 2026
🕘 Hora: 9:00 AM – 5:45 PM (GMT-6)
💻 Modalidad: Evento virtual en vivo
🗣️ Idioma: Español
💲 Costo: Gratuito
IEEE IEC R9 trabaja para fortalecer la colaboración entre la industria y la comunidad IEEE en Latinoamérica, promoviendo espacios donde profesionales de investigación, desarrollo, implementación, operación e innovación encuentren valor, visibilidad y oportunidades de colaboración dentro de IEEE.
El registro es gratuito y está abierto para todos los participantes.
Date and Time
Add Event to Calendar
Location
- This event has virtual attendance info. Please visit the event page to attend virtually.
Hosts
Registration
- Starts 13 May 2026 06:57 PM CST
- Ends 16 May 2026 12:00 AM CST
- No Admission Charge
Speakers
Ing. Miguel Jaime Correa
La Ciencia de Datos y la Inteligencia Artificial: Mitos, Realidad y Futuro
Prof. Eng. Mario Figueroa del Cruz
Intelligent Networks: AI and Connectivity in a Globalized World
Ing. Luis Octavio González Castolo
Bases de Diseño Electrónico Automotriz
Ing. Laura Jaqueline Santander Hernández
Conductores de Alto Desempeño Térmico
Ing. Abraham Reveles Pinedo
Load Shedding: La Última Línea de Defensa contra el Colapso de los Sistemas Eléctricos Modernos
Ing. Gabriel Orce
DevOps & MLOps: Del Ciclo de la Aplicación al Entrenamiento de Modelos de Aplicación
Dra. Dalia Holanda Chávez García
Metrología para la Industria de Semiconductores en América Latina: La Visión Estratégica de Panamá para la Competitivida
Agenda
Agenda | IEEE Industry Webinar & Panel Series 2026
| Hora (GMT-6) | Tema |
|---|---|
| 9:00 AM – 9:10 AM | Opening Remarks & Welcome |
| 9:10 AM – 10:00 AM | La Ciencia de Datos y la Inteligencia Artificial: Mitos, Realidad y Futuro |
| 10:00 AM – 10:50 AM | Intelligent Networks: AI and Connectivity in a Globalized World |
| 10:50 AM – 11:00 AM | Break |
| 11:00 AM – 11:50 AM | Bases de Diseño Electrónico Automotriz |
| 11:50 AM – 12:40 PM | Conductores de Alto Desempeño Térmico |
| 12:40 PM – 1:20 PM | Lunch Break |
| 1:20 PM – 2:10 PM | Load Shedding: La Última Línea de Defensa contra el Colapso de los Sistemas Eléctricos Modernos |
| 2:10 PM – 3:00 PM | DevOps & MLOps: Del Ciclo de la Aplicación al Entrenamiento de Modelos de Aplicación |
| 3:00 PM – 3:10 PM | Break |
| 3:10 PM – 4:00 PM | Metrología para la Industria de Semiconductores en América Latina |
| 4:00 PM – 4:50 PM | Introducción a la Ética e Integridad en la Ingeniería |
| 4:50 PM – 5:00 PM | Closing Remarks & Wrap-Up |
Organized by IEEE Industry Engagement Committee (IEC) Region 9
Connecting Industry and Engineering Across Latin America
📅 May 16, 2026 | 💻 Virtual Event | 🗣️ Spanish | 💲 Free Registration
IEEE Histelcon 2026 – Reg 7/ Reg 8 / Reg 9/ Reg 10
May 14th, 2026
Daniela Lopez de Luise 
HISTELCON 2026 IEEE R7/ R8/R9/R10
CFP, https://ieee-jp.org/japancouncil/event/histelcon2026/#call-for-papers



