CALL FOR PAPERS

2023 IEEE Latin American Electron Devices Conference, LAEDC

It is our pleasure to invite you to attend the fifth edition of the IEEE Latin American Electron Devices Conference, LAEDC 2023. A three-day event to be held at the hotel Presidente Intercontinental in Puebla, Mexico from 3-5 July 2023.

Puebla, officially Heroica Puebla de Zaragoza, is the capital of the homonymous state and the fourth largest city in Mexico. It is located in a valley framed by mountains and volcanoes, including Iztaccíhuatl, Popocatépetl, La Malinche and Pico de Orizaba, and is crossed from north to south by the Atoyac River.

LAEDC is the premiere Latin-American Electron Devices and related fields conference sponsored by IEEE’s Electron Device Society (EDS). The main goal is to bring together all Electron Device related fields to provide a unique global opportunity to share with specialists, senior scientists, students as well as young researchers to discuss their latest research and innovations.

The Conference is rapidly growing with worldwide participation and will address key topics in the field of Electron Devices, it will also be geared for students as well as young researchers and is financially sponsored by the IEEE Electron Devices Society (EDS). We are confident that thanks to your significant accomplishments and tangible contributions your presence will significantly add to the value of our conference and will motivate research groups and young generations in the field of Electron devices.

Accepted papers will be submitted for inclusion into IEEE Xplore Digital Library according to conference #58183, 2023 IEEE Latin American Electron Devices Conference (LAEDC), subject to meeting IEEE Xplore’s scope and quality requirements.

Topics of interest

Include, but are not limited to:
• All electron based devices
• Electron Devices for Quantum Computing
• Semiconductor-, MEMS- and Nano-technologies
• Packaging, 3D integration, Sensors and actuators
• Display technology
• Modeling and simulation
• Reliability and yield
• Device characterization
• Energy harvesting
• Biomedical Devices
• RF-MMW-5G
• Circuit-device interaction
• Novel materials and process modules
• Technology roadmaps
• Electron device engineering education
• Electron device outreach
• Optoelectronics, photovoltaic and photonic devices and systems
• Agrivoltaics
• 2D Materials and Devices
• Flexible electronics
• Reliability

Submission Guidelines

• Follow all details and instructions on our site https://attend.ieee.org/laedc-2023
• All papers must be uploaded using Microsoft CMT, following: https://cmt3.research.microsoft.com/LAEDC2023/
• Papers should be presented in English following the IEEE Transactions format for Conference Proceedings https://www.ieee.org/conferences/publishing/templates.html
• Papers must not exceed 4 pages in length.
• Please ignore the header.
• Do not number your pages.
• Authors are required to include the Digital Object Identifier (DOI), where available.
• Each reference cited must have a complete list of authors (no et al.), complete titles, first and last pages numbers, month and year.
• Do not include authors’ bios and photos

Important Dates
• Deadline Paper Submission: 31 March
• Notification of Acceptance: 1 May
• Camera Ready: 5 June
• Conference Dates: 3-5 July 2023

On behalf of the Conference committees, we look forward to welcoming you to LAEDC 2023. Please visit our website mentioned below for further details and registration https://attend.ieee.org/laedc-2023/ . For any questions, do not hesitate to contact us at laedc@ieee.org.

LAEDC 2023 Organizing Committee

Esteban Arias-Méndez | Co-Chair
Cor Claeys | Co-Chair
Mario Aleman | Treasurer and Chapters Summit
Fernando Guarín | Sponsorship and Exhibits
Edmundo Guitiérrez | Technical Program Chair
Pablo Moliterno | Technical Program Co-Chair
Jean Michelle Sallese | Publications Chair
Arturo Escobosa | Publications Co-Chair
Danny Xie-Li | Registration and Web Master
Julio Bello Pavón | Digital Platforms and Web Master
Jacobus Swart | Liaison Brazil
Patricia Guzman | Logistics and Events
Alba Ávila | Summer School Chair and WIE Summit
Lluis Marsal | Mini Colloquium Chair
Benjamin Iñiguez | MOS-AK Chair
Victor Grimblatt | Liaison Chile

Download Call for Papers Flyer: https://attend.ieee.org/laedc-2023/wp-content/uploads/sites/508/LAEDC-2023-CFPaper.pdf