SMI 2023 – Call for papers

CALL FOR PAPERS: SHAPE MODELING INTERNATIONAL (SMI) 2023

GENOVA, 4-6 July 2023

https://smiconf.github.io/2023/


Shape Modeling International (SMI) provides an international forum for the dissemination of new mathematical theories and computational techniques for modeling, simulating and processing digital representations of shapes and their properties to a community of researchers, developers, students, and practitioners across a wide range of fields. Conference proceedings will be published in a Special Issue of Computer & Graphics Journal, Elsevier. Papers presenting original research are sought in all areas of shape modeling and its applications.

This year SMI will be held in Genova, July 4-6, as part of the International Geometry Summit, together with SGP, SPM, GMP and GD.

SMI also participates in the Replicability Stamp Initiative, an additional recognition for authors who are willing to go one step further, and in addition to publishing the paper, provide a complete open-source implementation. For more details, check the SMI2023 website.


IMPORTANT DATES SMI 2023  (23:59 UTC/GMT):


Abstract submission: March 13, 2023

Full paper submission: March 20, 2023   

First review notification: April 20, 2023

Revised papers: May 8, 2023 

Second review notification: May 22, 2023

Camera ready full papers due: June 5, 2023

Conference: July 4-6, 2023


SUBMISSION:


Papers should present previously unpublished, original results that are not simultaneously submitted elsewhere.

The SMI  conference will use a double-blind review process. Consequently, all submissions must be anonymous.

All papers should be submitted using the easychair website.

Submissions should be formatted according to the style guidelines for the Computers &Graphics Journal and should not exceed 12 pages, including figures and references. We strongly recommend using the LaTeX template to format your paper. We also accept papers formatted by MS Word according to the style guidelines for Computers & Graphics. The file must be exported to a pdf file for the first round of submission. For format details, please refer to the Computers & Graphics Journal Guide for Authors.


SMI CONFERENCE CHAIRS:


Hui Huang                  Shenzhen University, China

Giuseppe Patanè       CNR-IMATI, Genova, Italy

Jorg Peters                University of Florida, USA


SMI TECHNICAL PAPERS CHAIRS:


Georges-Pierre Bonneau     University of Grenoble-Alpes, France

Ligang Liu                 University of Science and Technology of China

Michela Mortara            CNR-IMATI, Genova, Italy


SMI COMMUNICATION CHAIRS:


Ergun Akleman              Texas A&M University, USA

Silvia Biasotti            CNR-IMATI, Genova, Italy

Yang Liu                   Microsoft Research Asia, Beijing, China


LIST OF TOPICS (non restrictive):


Curves and surfaces

Implicit surfaces

Triangle and polygonal meshes

Parametric and procedural models

Acquisition and reconstruction

Compression and streaming

Healing and resampling

Segmentation

Medial and skeletal representations

Correspondence and registration

Feature extraction and classification

Shape analysis and synthesis

3D retrieval

Shape statistics

Exploration of shape collections

Shape transformation and deformation

Behaviour and animation models

Computational topology

Learning techniques for shape modeling

Geometric deep learning

Digital fabrication and 3D printing

Simulation

3D Digital Twins

Interactive modeling, design and editing

Sketching and 3D input modalities

AR/VR environments

Semantics of shapes

Shape modeling applications (product design, biomedicine, GIS, geoscience, art, education and training, cultural heritage, gaming, and others)

TMLS2022 Diversity Scholarship & Career Fair

 
 
Hey there,

We're very proud to announce the TMLS2022 Diversity & Inclusion Scholarship – our way of ensuring that the summit is accessible to everyone.

Our goal at TMLS has always been to create an inclusive community so if you identify as a Women in Tech, Indigenous/First Nations, LGBTQ+, disabled, laid off or a member of a minority group that has been historically underrepresented, then we'd love to host you at the summit!

Please submit your application here Diversity & Inclusion Scholarship before Nov. 11th. You will be notified by Nov. 15th if you have been selected.

If you are looking for work, come meet leaders and talent managers behind the most powerful Machine Learning companies to see their work and the roles they are hiring for free.

Participating companies include Aporia, Dataiku, Autodesk, Loblaw Digital, SpotHero, Sobeys, CentML and more…

Selected Roles Include Machine Learning Engineer, Senior Data Scientist, MLOPs Engineer, Enterprise Account Executive, Product Manager, AI/ML, ML Solutions Engineer and more…

Please register here: Start-up Showcase & Career Fair


If you are a startup or a hiring team please submit this form to participate.

We are thankful for the support of our partners for helping make this possible.

 


Call for poster: IEEE ISPA2022 (Parallel and Distributed Processing with Applications), Dec. 2022

Call for Poster:
The 20th IEEE International Symposium on Parallel and Distributed Processing with Applications (ISPA 2022), 17-19 Dec. 2022, Melbourne, Australia.
         
Website: http://www.swinflow.org/confs/2022/ispa/poster.htm

Important Dates:
Deadline for proceedings published posters with display at conference: 13 November 2022

Notification of Acceptance: 15 November 2022

Final versions of proceeding published posters: 18 November 2022

Submissions:
Please email your posters/demos to confs.aus@gmail.com with the email subject as “ISPA 2022 poster submission”.

Invitación “Charlas con Especialistas”

 
Nos resulta  grato invitarlas/os a la segunda “Charlas con Especialistas” organizadas desde el SIED – UNLP y la Dirección General de Educación a Distancia y Tecnologías. Como les comentamos en la oportunidad anterior, nos proponemos convocar a un espacio reflexivo sobre las “Escenas y Escenarios de Hibridaciones en la Universidad”.
 
El segundo de estos encuentros, último de este año,  tendrá lugar este martes 8 de noviembre a las 18 hs y estará a cargo de la Mg. Mariana Landau para abordar el tema: “Sujetos y objetos de las prácticas de la enseñanza en la educación superior. Consideraciones desde la Tecnología Educativa.”
 
Las charlas serán abiertas a la comunidad y transmitidas por el Canal de YouTube de de la Dirección.
 
No se emitirán certificados y las preguntas y consultas a la especialista podrán ser realizadas mediante el Chat de Youtube.
 
Saludos cordiales.
 

CAE 2023 Final Deadline Extension

 
 
 
 
 

CAE 2023 & EAMTA 2023 CFP extension:

Due to numerous requests, the CFP has been extended: 25 Nov, 2022

4th Argentine Conference on Electronics (CAE) and 16th Argentina School of Micro-Nanoelectronics, Technology and Applications
9-10 March, 2023 / 4-10 March, 2023

Hybrid Modality

The Argentine Conference on Electronics is a high technical quality forum for researchers and technologists in the field of electronic and associated technologies, that arises as a spin off of the Argentine School of Microelectronics. In this fourth edition, papers will be accepted in the following topics:

• Micro/Nano Electronics
 Devices
• Implantable Electronics
• IoT
• Neural Networks and Machine Learning
• Power Electronics
• Signal Processing and Filtering
• Space and Nuclear Applications

REGULAR papers will be submitted for inclusion in IEEE Xplore. A selection of the best papers will be invited to submit an extended version to the International Journal of Circuit Theory and Applications (Wiley).

IMPORTANT DATES:
Deadline for submission of papers: 25 November, 2022
Notification of acceptance: 20 December, 2022
Deadline for submission of final papers: 9 January, 2023

ADVANCED STUDENT AND PHD (S-PHD) FORUM
The S-PhD Forum gives an opportunity to advanced students, PhD students and recent graduates to present their work in the event. Prospective authors should submit a 4 page summary paper of their work. Papers will be evaluated by a committee and accepted works will be presented in poster format. S-PhD papers will be available online at the conference website.

For inquiries: cae.congress@gmail.com
www.cae.net.ar

 
 
 
 

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