WCCI 2022 SS on Advances in Deep Fuzzy Systems

December 28th, 2021 Daniela Lopez de Luise

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I would like to invite you to join the IEEE WCCI 2022 Special Session on Advances in Deep Fuzzy Systems. Our proposal for this special session has been accepted and its draft description is attached to this email for your information.

 

Kind regards,

 

Alexander

 

doc icon WCCI_2022_SPECIAL_SESSION.docx
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Call for Papers 7th International Conference of Smart Data and Smart Cities: 19-21 October, 2022, Sydney, Australia

December 28th, 2021 Daniela Lopez de Luise

Dear all,

 

The 7th International Smart Data and Smart Cities (SDSC) Conference will be held in Sydney, Australia, from 19 to 21 October 2022. SDSC is a leading international conference focussed on the dissemination and exchange of knowledge and research results relating to urban innovation and smart technologies across the EU, North and South America and Australasia. It is initiated by the Urban Data Management Society (UDMS) and is organised under the auspices of the International Society of Photogrammetry and Remote sensing (ISPRS).

 

The conference will provide a hybrid environment with online and face-to-face venues, to facilitate a range of discussions and presentations from esteemed scholars and experienced professionals.

 

Important dates:

Extended abstract due: 15 March 2022

Full paper submission due: 15 April 2022

Author notification: 1 May 2022

Final paper submission due: 10 July 2022

Conference Days: 19-21 October 2022

 

Conference Website https://conference.unsw.edu.au/en/7th-Smart-Data-and-Smart-Cities-Conference

 

Season greetings and all the best for 2022.

 

Volker Coors

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Call for Papers T-CAP Workshop @ ICIAP 2022

December 28th, 2021 Daniela Lopez de Luise

Call for Papers

“Towards a Complete Analysis of People: From Face and Body to Clothes (T-CAP)”

International Workshop at ICIAP 2021
https://sites.google.com/view/t-cap2021

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=== SUBMISSIONS ARE OPEN!!! ====

Two types of paper are welcome::

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IEEE AR EDS/SSCS – Webinar “Dielectric breakdown in thin dielectrics”

December 21st, 2021 Daniela Lopez de Luise

To view complete details for this event, click here to view the announcement

IEEE AR EDS/SSCS – wEBINAR: “Dielectric breakdown in thin dielectrics. From silicon dioxide to layered dielectrics”

The IEEE Joint Chapter EDS/SSCS of the Argentina Section invites you to the webinar “Dielectric breakdown in thin dielectrics. From silicon dioxide to layered dielectrics”.
It will be delivered by the IEEE EDS Distinguished Lecturer Dr. Félix Palumbo, and will take place on Monday, December 27, 2021, starting at 17:30 AR (GMT-3).
 
Abstract
Thin dielectrics are the fundamental stone over which the semiconductor industry experienced its huge development. As the key element for manufacturing Metal Oxide Semiconductor Field Effect Transistors, guaranteeing the reliability of gate oxides has become more challenging with the pushing demands of the markets for improved performance in electronic devices. In this framework, understanding not only the statistics but the physical phenomena behind dielectric breakdown is crucial to ensure the reliability of modern and future electronic devices. In this lecture, the fundamentals of thin dielectric breakdown and the state of the art of breakdown studies on novel materials are summarized, focusing on the physical phenomena that characterize thin-film dielectric breakdown and the perspectives on novel 2D materials, that demonstrate a remarkable potential to be applied as gate insulators in future nano-electronic devices.
 
Speaker: Dr. Félix Palumbo
Félix Palumbo (Member, IEEE) received the M.Sc. and Ph.D. degrees in physics from the University of Buenos Aires, Argentina, in 2000 and 2005, respectively. He is currently an Active Researcher in the field of semiconductor device physics and reliability, with experience in the academy and industry.  
 
Date and time     
     Monday, December 27, 2021, starting at 17:30 AR (GMT-3).     
     The webinar will be delivered in English.
     Access data to the webinar will be sent by email to registrants on the day of the event.
 
Registration     
     No admission charge.
     Advanced registration is requested, through

 

  • IEEE EDS               IEEE SSCS                                                                                                                                                    

 

Argentina Section : http://www.ieee.org.ar/

Manage your IEEE Communication Preferences at the IEEE Privacy Portal


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CFP ICPRAI 2022 : deadline extension

December 21st, 2021 Daniela Lopez de Luise

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You are invited to submit a paper for the third International Conference on Pattern Recognition and Artificial Intelligence (ICPRAI 2022)
It will be held in PARIS 1st to 3rd June 2022

 

At the moment in Paris (France), we cannot predict what will be sanitary situation next June. In this context, we cannot schedule for sure, how the conference will take place. We hope most of you can travel for an on site conference, but an hybrid version is also in preparation.

 

Scope of the Conference
The conference aims to bring together researchers, students and practitioners of pattern recognition and artificial intelligence, to present and discuss new advances.
Pattern recognition : recognition of different types of patterns, feature extraction / selection and evaluation, structural / statistical approaches
Computer vision : image processing / analysis, segmentation, object recognition, scene understanding
Artificial intelligence : machine / deep learning, expert systems, system interpretability, knowledge representation, perception, semantic analysis, intelligent systems
Big data : data visualization, volume / velocity / data variety, small sample size, supercomputing, cloud, data mining and performance evaluation
With applications related to: handwriting, document, text, language processing, e-learning, image processing / analysis, bio-medical imaging, remote sensing, image retrieval, 2D / 3D images and graphics, audio / video, multimedia applications, security and forensic studies, mobile applications, face, fingerprint, iris, brain, strategic objects and targets, industrial applications of PRAI, innovation and technology transfer, financial trends and analysis, traffic analysis and smart transportation systems, robotics and autonomous vehicles …

 

With 5 special sessions
·      Medical Applications of Pattern Recognition and AI
·      Analysis and learning of multi-variate, multi-temporal, multi-resolution and multi-source remote sensing data
·      Graphs for Pattern Recognition: Representations, Theory and Applications
·      Time series analysis
and 
3 keynotes

 

A Special Issue is scheduled for the best papers in IJPRAI journal
As well as a Special Section of the Pattern Recognition Letters (Elsevier) journal.

 

 

Proposed by:
Honorary Chair          Ching Y. Suen (Canada) 
General chair              Nicole Vincent (France)  
Conference Co-Chairs           Edwin Hancock (UK)
Yuan Y. Tang (China) 
Program Chairs          Mounim El Yacoubi (France)
                        Umapada Pal (India)
                        Eric Granger (Canada)
                        Pong C. Yuen (China)

 

Key dates
Deadline for Paper submission: 15/01/2022
Author notification: 8/03/2022
 
Submissions
The conference solicits papers covering any of these topics. Papers will be 12 pages of content in the Springer LNCS style and should report on novel, unpublished work.

 

The proceedings of the conference will be published as a Lecture Notes in Computer Science (LNCS) proceedings volume.

 

Contact

 

 

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