Call for Papers: IEEE INTERCON 2022 | XXIX International Conference on Electronics, Electrical Engineering and Computing

We are pleased and honored to invite you to join the 2022 IEEE XXIX International Conference on Electronics, Electrical Engineering and Computing – INTERCON. This conference aims to bring together researchers, professionals, students and entrepreneurs to facilitate the approach, identification and commitment to join challenges that allow the development of technologies for the benefit of humanity.

CFP INTERCON 2022 has been redesigned in a virtual environment, for the safety of our community and to offer an inclusive experience. For oral presentations, will use teleconferences tools to prepare interactive presentation sessions. Remote hosts will use a common remote presence software tool which will be determined and announced by the organizing committee.

Topics of interest include, but are not limited to:

• Communication systems
• Semiconductor and devices
• Computers and information technology
• Signal processing
• Systems and control
• Emerging technologies
• Circuits and systems
• Power generation, transmission and distribution
• Renewable energy sources, smartgrids technologies
• Optoelectronic materials, devices and systems
• Climatic change & Renewable energy
• DC systems in High Voltage, BESS and nuclear power plants.
• Power electronics, systems and applications
• Electrical machines and adjustable speed drives
• High voltage engineering and insulation technology
• Algorithms and complexity
• Architecture and organization
• Graphics and visualization
• Information management, assurance and security
• Intelligent systems
• Parallel and distributed Computing
• Software engineering
• Social issues and professional practice
• Research & Development restrictions and improvements

Submission
The official language of 2022 IEEE INTERCON is ENGLISH. The maximum number of authors per paper, including co-authors is four (4). Papers must be submitted in PDF and no longer than four (4) pages, following the IEEE Conference Template available at:
https://www.ieee.org/conferences/publishing/templates.html
We will use EasyChair system for submissions here:
https://easychair.org/conferences/?conf=2022ieeeintercon
Accepted technical papers will be submitted to the IEEE Xplore Digital Library.

Organizing Committee
Conference Chair: Jorge Lafitte (dr.jorge.lafitte@ieee.org)
Conference Treasurer: Romel Jimenez (rjimenez@ieee.org)
Technical Program Chair: Ricardo Arias (ricardo.ariasvelasquez.eng@ieee.org)
Publication Chair: Jose Duran (joseduran@ieee.org)
Publication Co Chair: Marco Cruz (marcocruz@ieee.org)
Information Contact:
Nicole Caballero (nicole.caballero@ieee.org)
Dario Utrilla (dutrillas@unmsm.edu.pe)
Fiorella Montalvo (fiorella_montalvo@ieee.org)

[+] Information: https://www.intercon.org.pe/2022/