Andescon 2024 – Cusco 11-14 setiembre 2024
February 5th, 2024
Daniela Lopez de Luise
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April 1st, 2024
Deadline Paper Submission
June 09th, 2024
Notification of Acceptance
June 30th, 2024
Camera Ready Submission
September 11th-14th, 2024
Conference Date
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General Chairs
César A. Beltrán Castañón
IEEE Peru Section Chair
IEEE Andean Council Chair
Andres Navarro
Universidad Icesi
(Colombia)
Technical Program Chair
Julio Cuisano
PUCP (Perú)
Finance Chairs
Jimmy Túllume Salazar
IEEE Perú Section
Publication Chairs
Pedro Shiguihara
José Duran
IEEE Perú Section
WebMaster
Carlos Sánchez Acosta
IEEE Perú Section
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ANDESCON is the biannual Technical and Scienti Scientific Conference of the Andean Council of the IEEE that brings together IEEE professionals and scientists from the Andean countries. The twelfth edition of this IEEE event will be held in the wonderful city of Cusco, Perú. The ANDESCON conference is an opportunity for professional members, academics, researchers and industrialists to will meet and present the developments and technological advances that move the Andean region countries.
CUSCO: The Heart of the Inca Empire, is a fascinating city located in the Southern Sierras, Cusco is a UNESCO World Heritage Site and is one of Peru most visited cities as it is the largest and most comfortable city from which tourists can visit Machu Picchu (one of the 7 wonders of the world), the Sacred Valley of the and other Inca sites in the region Peru has many additional treasures to visit (http://peru.travel/).
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TOPICS OF INTEREST
but not limited to
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The articles must be submitted in digital format (PDF) through the paper submission page. Papers must be written in English. Papers must use the IEEE conference format.
The maximum length is six (6) pages per article including illustrations and references.
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 /andescon2024
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