Andescon 2024 – Cusco 11-14 setiembre 2024

February 5th, 2024 Daniela Lopez de Luise

 

 

April 1st, 2024
Deadline Paper Submission
 
June 09th, 2024
Notification of Acceptance
 
June 30th, 2024
Camera Ready Submission
 
September 11th-14th, 2024
Conference Date
 
 
 
General Chairs
César A. Beltrán Castañón
IEEE Peru Section Chair
 
IEEE Andean Council Chair
Andres Navarro
Universidad Icesi
(Colombia)
 
Technical Program Chair
Julio Cuisano
PUCP (Perú)
 
Finance Chairs
Jimmy Túllume Salazar
IEEE Perú Section
 
Publication Chairs
Pedro Shiguihara
José Duran
IEEE Perú Section
 
WebMaster
Carlos Sánchez Acosta
IEEE Perú Section
 
Information and registrations
informes@ieee.org.pe
 
 
ORGANIZED BY:
 
 
 
ANDESCON is the biannual Technical and Scienti Scientific Conference of the Andean Council of the IEEE that brings together IEEE professionals and scientists from the Andean countries. The twelfth edition of this IEEE event will be held in the wonderful city of Cusco, Perú. The ANDESCON conference is an opportunity for professional members, academics, researchers and industrialists to will meet and present the developments and technological advances that move the Andean region countries.
CUSCO: The Heart of the Inca Empire, is a fascinating city located in the Southern Sierras, Cusco is a UNESCO World Heritage Site and is one of Peru most visited cities as it is the largest and most comfortable city from which tourists can visit Machu Picchu (one of the 7 wonders of the world), the Sacred Valley of the and other Inca sites in the region Peru has many additional treasures to visit (http://peru.travel/).
 
TOPICS OF INTEREST
but not limited to
 
Circuits, Systems and Electron Devices
Computational Intelligence
Education in Engineering
Industrial Electronics
Robotics and Automation Systems
Smart Cities and Smart Mobility
Technology & Engineering Management
Communications
Computer and Software Engineering
Engineering in Medicine and Biology
Power and Energy
Signal Processing & Aerospace
Systems and Control
Mechanics and materials
 
PAPER SUBMISSION
 
The articles must be submitted in digital format (PDF) through the paper submission page. Papers must be written in English. Papers must use the IEEE conference format.
The maximum length is six (6) pages per article including illustrations and references.
 

 
/andescon2024
 

Posted in Congress
«
»
Both comments and pings are currently closed.

Comments are closed.

Design by 2b Consult