Missed EI 2021? Content NOW Online, Register for Access

If you missed the Electronic Imaging Symposium (EI 2021 ONLINE), you still have access to all of its great content for a limited time. 

Recorded content includes plenary talks from Michal Irani, Ken Parulski, EI 2021 Scientist of the Year, Ramesh Raskar, and Luca Verre.

Additionally, you can view keynote and invited talks from innovators at Google, IEEE, Amazon, Adobe, and more, along with 20 short courses led by experts in the fields of automotive imaging, 3D, AR/VR, machine vision, deep learning, and so much more.

Electronic Imaging Symposium 2021 (EI 2021 Online)
Register by 15 April. Recordings are available until 30 April 2021. https://bit.ly/EI2021

Connect with us on LinkedIn and Twitter @ElectroImaging for #EI2022 updates!

Roberta Morehouse, CMP
Communications and Marketing Manager
Society for Imaging Science and Technology (IS&T)
-imaging across applications-imaging.org
IS&T is a non-profit organization dedicated to advancing science and technology in the field of imaging.  Please consider donating today. https://bit.ly/ImagingOrg_Donations

HEAd’21 – Call for papers (online edition)

HEAd'21: Call for Papers

7th International Conference on Higher Education Advances

June 22 – 23, 2021. Virtual conference
http://www.headconf.org
twitter: @headconf

Scope

The Seventh International Conference on Higher Education Advances (HEAd'21) is a consolidated forum for researchers and practitioners to exchange ideas, experiences, opinions and research results relating to the preparation of students, teaching/learning methodologies and the organization of educational systems.

The HEAd'21 conference will be held on June 22-23, 2021 as a virtual meeting organized from the Faculty of Business Administration and Management of the Universitat Politecnica de Valencia (UPV), which has been recently ranked as the best technical university in Spain by the Academic Ranking of World Universities (ARWU) 2020.

Topics of interest

The program committee encourages the submission of articles that communicate applied and empirical findings of interest to higher education professionals.

Topics of interest include, but are not limited to, the following topic areas:

  • Innovative materials and new tools for teaching
  • Educational technology (e.g., virtual labs, e-learning)
  • Evaluation and assessment of student learning
  • Emerging technologies in learning (e.g., MOOC, OER, gamification)
  • Scientific and research education
  • Experiences outside the classroom (e.g., practicums, mobility)
  • New teaching/learning theories and models
  • Globalization in education and education reforms
  • Education economics
  • Teaching and learning experiences
  • Entrepreneurship and learning for employment
  • Education accreditation, quality and assessment
  • Competency-based learning and skill assessment

Important Dates

Submission deadline: February 25, 2021
Acceptance notification: April 27, 2021
Camera ready due: May 13, 2021
Conference dates: June 22-23, 2021

Publications

All accepted papers will appear in the conference proceedings with a DOI and ISBN number. They will be published in open access by UPV Press and submitted to be indexed in major international bibliographic databases. Previous editions are indexed in Scopus and the Thomson-Reuters Conference Proceedings Citation Index – Web of Science Core Collection (former ISI Proceedings).

Awards

The Program Committee will select the winners for the Best Paper and Best Student Paper awards. To be eligible for the best student paper award, the presenting author of the paper must be a full-time student.

Submission guidelines

Authors from all over the world are invited to submit original and unpublished papers, which are not under review in any other conference or journal. All papers will be peer reviewed by the program committee based on their originality, significance, methodological soundness, and clarity of exposition.

Submitted papers must be written in English and should be in PDF format. They must follow the instructions in the template file, available in Microsoft Word format at:

http://www.headconf.org/template.docx

Paper length must be between 4 and 8 pages, incorporating all text, references, figures and tables. Submissions imply the willingness of at least one author to register, attend the conference, and present the paper.

HEAd'21 is using the OCS platform of UPV Press to manage the submissions. This platform provides you with a submissions homepage where you can register your paper submission and make appropriate changes. The submission website is:

http://www.headconf.org/submission-instructions/

The organizing committee looks forward to welcoming you all to a fruitful conference with open discussions and important networking to promote high quality education.

Call for Papers – ROBOVIS 2021

CALL FOR PAPERS

2nd International Conference on Robotics, Computer Vision and Intelligent Systems

Submission Deadline: May 18, 2021

http://www.robovis.org

October 27 – 28, 2021

Valletta, Malta

Robotics is a field that is closely connected to Computer Vision and Intelligent Systems. Research and development of robots require technologies originating from the other two areas; the research work in Computer Vision has often been driven by needs in Robotics; Intelligent Systems models and software have often been developed aiming at applications in the areas of physical agents, i.e. robots, or in areas  related to scene understanding, video and image processing, and many other aspects of computer vision. There is a need for a venue where these three research communities, often isolated, meet and discuss innovation possibilities driven by the intersection of these highly synergetic fields.

ROBOVIS is organized in 3 major tracks:
1 – Robotics
2 – Computer Vision
3 – Intelligent Systems

Conference Chair(s)
Krzysztof Kozlowski, Poznan University of Technology, Poland

Program Chair(s)
Péter Galambos, Óbuda University, Hungary
Erdal Kayacan, Aarhus University, Denmark

Proceedings will be submitted for indexation by:
SCOPUS
Google Scholar
The DBLP Computer Science Bibliography
Semantic Scholar
Microsoft Academic
Engineering Index (EI)
Web of Science / Conference Proceedings Citation Index

A short list of presented papers will be selected so that revised and extended versions of these papers will be published by Springer in a CCIS Series book.

All papers presented at the conference venue will also be available at the SCITEPRESS Digital Library.

Kind regards,
Marina Carvalho
ROBOVIS Secretariat

IEEE INTERCON 2021 – XXVIII International Conference on Electronics, Electrical Engineering and Computing

 
 
 
 
 
 
 

The 2021 IEEE XXVIII International Conference on Electronics, Electrical Engineering and Computing – INTERCON aims to bring together researchers, professionals, students and entrepreneurs to facilitate the approach, identification and commitment to join challenges that allow the development of technologies for the benefit of humanity.

2020 INTERCON will be a VIRTUAL CONFERENCE.

Topics of interest include, but are not limited to:
Communication systems
Semiconductors and devices
Computers and information technology
Signal processing
Systems and control
Emerging technologies
Circuits and systems
Power generation, transmission and distribution
Renewable energy sources, Smartgrid technologies
Optoelectronic materials, devices and systems
Power electronics, systems and applications
Electrical machines and adjustable speed drives
High voltage engineering and insulation technology
Algorithms and complexity
Architecture and organization
Graphics and visualization
Information management, assurance and security
Intelligent systems
Parallel and distributed Computing
Software engineering
Social issues and professional practice

Submission:
The official language of 2021 IEEE INTERCON is ENGLISH. The maximum number of authors per paper, including co-authors is four (4). Papers must be submmited in PDF and no longer than four (4) pages, following the IEEE Conference Template available at:
https://www.ieee.org/conferences/publishing/templates.html
We will use EasyChair system for submissions here: https://easychair.org/conferences/?conf=2021ieeeintercon

Important dates
Full paper submission deadline: May 15, 2021
Notification of acceptance: June 30, 2021
Final paper submission deadline: July 10, 2021
Author registration: July 15, 2021
Oral presentations: August 5 to 7, 2021

More information: https://www.intercon.org.pe/2021/

Deadline extended to March 31, 2021 – CfP: Special Issue on Artificial Intelligence for Health – MDPI Computers Journal (indexed in ESCI-Web of Science and Scopus)

it is our pleasure to inform you of a deadline extension for the Special
Issue on Artificial Intelligence for Health, run by Computers journal.
The new deadline is: March 31, 2021.

https://www.mdpi.com/journal/computers/special_issues/AI_Health

Please find below further information on this Special Issue.
I hope it may be of interest for you.
Also, please let me apologize if you receive multiple copies of this CFP.

Yours sincerely
Ivanoe De Falco

***************************************************
MDPI COMPUTERS JOURNAL

Special Issue on Artificial Intelligence for Health

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