On-Site and Remote: September 3 Deadline for eKNOW 2020 || November 21 – 25, 2020 – Valencia, Spain

Greetings,

With everyone's health and safety in mind, we are adapting some of the ways in which IARIA conferences are organized:

1. The submission deadlines (and other dates such as notification and camera ready) are rather flexible in order to account for possibly limited author access to the academic/industrial premises where the research work is taking place.

2. During the conference, authors will be able to present their work via pre-recorded videos and/or conference calls (in case they opt to avoid travel).

3. Selection of awarded papers and invitations for expanded versions for IARIA journals are not affected by the presentation method (pre recorded or in person).

We wish you health and safety during these times.

That being said, note that the submission deadline has been extended to September 3.

Please consider to contribute to and/or forward to the appropriate groups the following opportunity to submit and publish original scientific results to:

– eKNOW 2020, The Twelfth International Conference on Information, Process, and Knowledge Management

Authors of selected papers will be invited to submit extended article versions to one of the IARIA Journals: https://www.iariajournals.org

=================

============== eKNOW 2020 | Call for Papers ===============

CALL FOR PAPERS, TUTORIALS, PANELS

eKNOW 2020, The Twelfth International Conference on Information, Process, and Knowledge Management

General page: http://www.iaria.org/conferences2020/eKNOW20.html

Submission page: http://www.iaria.org/conferences2020/SubmiteKNOW20.html

Event schedule: November 21 – 25, 2020 – Valencia, Spain

Contributions:

– regular papers [in the proceedings, digital library]

– short papers (work in progress) [in the proceedings, digital library]

– ideas: two pages [in the proceedings, digital library]

– extended abstracts: two pages [in the proceedings, digital library]

– posters: two pages [in the proceedings, digital library]

– posters:  slide only [slide-deck posted at www.iaria.org]

– presentations: slide only [slide-deck posted at www.iaria.org]

– demos: two pages [posted at www.iaria.org]

– doctoral forum submissions: [in the proceedings, digital library]

Proposals for:

– mini symposia: see http://www.iaria.org/symposium.html

– workshops: see http://www.iaria.org/workshop.html

– tutorials:  [slide-deck posed on www.iaria.org]

– panels: [slide-deck posed on www.iaria.org]

Submission deadline: September 3, 2020

Sponsored by IARIA, www.iaria.org

Extended versions of selected papers will be published in IARIA Journals:  http://www.iariajournals.org

Print proceedings will be available via Curran Associates, Inc.: http://www.proceedings.com/9769.html

Articles will be archived in the free access ThinkMind Digital Library: http://www.thinkmind.org

The topics suggested by the conference can be discussed in terms of concepts, state of the art, research, standards, implementations, running experiments, applications, and industrial case studies. Authors are invited to submit complete unpublished papers, which are not under review in any other conference or journal in the following, but not limited to, topic areas.

All tracks are open to both research and industry contributions, in terms of Regular papers, Posters, Work in progress, Technical/marketing/business presentations, Demos, Tutorials, and Panels.

Before submission, please check and comply with the editorial rules: http://www.iaria.org/editorialrules.html

eKNOW 2020 Topics (for topics and submission details: see CfP on the site)

Call for Papers: http://www.iaria.org/conferences2020/CfPeKNOW20.html

============================================================

Knowledge fundamentals

Knowledge acquisition, processing, and management; Linguistic knowledge representation; Knowledge modeling and virtualization; Types of knowledge: structural, behavioral, relationships, etc.; Knowledge representation: visual-picture, connectionist model, semi-structured [a la workflow], structured/formal; Knowledge acquisition status: potential new knowledge, guessed semantics, confirmed semantics, auditing confirmed semantics, etc.; Knowledge update: probable insertion, validated insertion, auditing the insertion periodically based on new knowledge, etc.

Advanced topics in Deep/Machine learning

Distributed and parallel learning algorithms; Image and video coding; Deep learning and Internet of Things; Deep learning and Big data; Data preparation, feature selection, and feature extraction; Error resilient transmission of multimedia data; 3D video coding and analysis; Depth map applications; Machine learning programming models and abstractions; Programming languages for machine learning; Visualization of data, models, and predictions; Hardware-efficient machine learning methods; Model training, inference, and serving; Trust and security for machine learning applications; Testing, debugging, and monitoring of machine learning  applications; Machine learning for systems.

Trends on annotation and extraction

Natural Languages-based features and systems; Annotation handling (multilingual, semantic, shared, open, prosody, etc.); Annotation as a Service (AaaS); Handling argument-based knowledge; Event-based knowledge; Tagging and supertagging; Extraction patterns; Uncertain reasoning; Visual error analysis; Domain-specific paraphrase extraction; Tweets and sentence compression; Role labeling semantic; Heterogeneous annotations

Trends on news and social media

New events-based knowledge;In-context news creation; Superlative expressions; News highlights generation systems; News special summarization systems (e.g, for blind and/or visually impaired people); Sentiment classification (emotion, irony, sarcasm, rhetorical questions, opinion, etc.); Rumor dynamics and social media; Contextual pragmatic models;; Social prediction; Prediction semantic analysis; Predictability of distrust; Aspect-based sentiment analysis; Argument generation systems; Relevance of citation recommendation; Retrieval bias and retrieval performance; High-speed captioning images; Language models for images; Participative KM platforms

Trends on knowledge processing support and mechanisms

Open knowledge bases; Structured knowledge bases; Big knowledge applications; Linked knowledge objects; Knowledge datasets; Machine translation systems; Convolution neural networks; Hybrid representations and equivalent semantics; Processing bilingual information; Topic trends and temporal signatures; Cross-view features; Pattern-based knowledge; Ranking optimization in context; Concept-based classification and ranking; KM design for life long learning and long term uses

Knowledge identification and discovery

Mining for knowledge; Knowledge identification: semantic-ID, etc.; Knowledge discovery: how to express knowledge requests?, how to find knowledge?, etc.; Knowledge refinement: after many acquisitions, former knowledge can change semantically or structurally, etc.; Knowledge clustering

Knowledge management systems

Knowledge data systems; Industrial systems; Context-aware and self-management systems; Imprecision/Uncertainty/Incompleteness in databases; Cognitive science and knowledge agent-based systems; Databases and mobility in databases; Zero-knowledge systems; Expert systems; Tutoring systems; Digital libraries

Knowledge management (KM) and event processing (EP)

Methodologies and approaches to overcome technical hurdles and improve the interplay between KM and EP; Applications from various domains (e.g. financial, manufacturing, trading, telecommunication, service), which benefit from an integrated KM and EP

Knowledge semantics processing and ontology

Dynamic knowledge ontology; Collaborative knowledge ontology; Knowledge matching; Contextual reasoning; Tools for knowledge ontology; Context-based information extraction; Knowledge trading systems; Knowledge exchange portals; Cognitive sytems and knowledge processing; Human aspects in knowledge processing

Technological foresight and socio-economic evolution modelling

Anticipatory networks and decisions; Expert information management; Foresight support systems; Generating technological recommendations and rankings; Information society evolution; Online and real-time Delphi; Ontological knowledge bases of technologies and products; Roadmapping support systems; Strategic support systems; Technological information fusion; Technological policy decision support systems

Process analysis and modeling

Analysis and development of business architectures; Data mining and information retrieval for business processes; Business process modelling; Business process composition; Analysis and management lifecycle; Reasoning on business processes; Optimization of business processes; Adaptive business processes; Business process reengineering; Integration of processes; Process discovery; Business process quality; Resource allocation

Process management

Criteria for measurement of business process models; Monitoring business processes; Business process visualization; Management of business process integration; On-demand business transformation; Performance measurement; Conformance and risk management; Prediction; Business transformation; Packaged industry applications; Industry solutions

Information management

Informational mining/retrieval/classification; Geographic and spatial data Infrastructures; Information technologies; Information management systems; Information ethics and legal evaluations; Optimization and information technology; Organizational information systems

Decision support systems

Multi-criteria decision theory; Artificial intelligence; Adaptive design for decision support systems; Support technologies: knowledge-driven, data-driven, model-driven, and geographically-driven systems; Support methods: artificial neural networks, fuzzy logic, and genetic/evolutionary algorithms; Modeling, interfaces, and performance; Applications using decision support systems

3 weeks to CIOE 2020: Key exhibitors and New Exhibitors

If you cannot view the email, please click here.

September 9-11, 2020
Wednesday – Friday
cioe 2020
CIOE 2020 New Venue: Shenzhen World Exhibition & Convention Center
● Register Now        ● Why Visit         ● About CIOE          ● Exhibitor Profile & Floor Plan         ● Contact Us
CIOE 2020 (the 22nd China International Optoelectronic Exposition) will gather around 3,000 optoelectronic companies covering the 6 major industries of information and communication, optics, Infrared, lasers, sensor and photonics.
Leading optoelectronic companies such as Innoviz, Onsemi, Han’s Laser, Dali, Hisilicon, HGTECH, HEXAGON, Everbright, MantisVision will showcase their topnotch products and technologies onsite.
Register and meet them face to face to find the new products and expand your networking at Shenzhen World Exhibition & Convention Center from September 9 to 11.
Register Now
Meet Over 3,000 Optoelectronic Peers at the
Must-attend Sourcing Exhibition
Innoviz Technologies Ltd.
Innoviz Technologies Ltd.
ams AG
ams AG
ON Semiconductor
ON Semiconductor
Photonteck Company Limited
Photonteck Company Limited
CIG SHANGHAI CO., LTD
CIG SHANGHAI CO., LTD
InnoLight Technology (Suzhou) Ltd
InnoLight Technology (Suzhou) Ltd.
Han's Laser Technology Industry Group Co., Ltd
Han's Laser Technology Industry Group Co., Ltd
Shanghai zhikaijie Laser Technology Co., Ltd.
Shanghai zhikaijie Laser Technology Co., Ltd.
Shenzhen Maxphotonics Co. Ltd.
Shenzhen Maxphotonics Co. Ltd.
Global Sensor Technology.,Ltd
Global Sensor Technology.,Ltd
Hubei Jiuzhiyang Infrared System Co., Ltd.
Hubei Jiuzhiyang Infrared System Co., Ltd.
Zhejiang Dali Technology Co., Ltd
Zhejiang Dali Technology Co., Ltd
Zhejiang Sunny Optics Co., Ltd.
Zhejiang Sunny Optics Co., Ltd.
Phenix Optics Co., Ltd.
Phenix Optics Co., Ltd.
Shenzhen Desay Industry Research Institute Co., Ltd.
Shenzhen Desay Industry Research Institute Co., Ltd.
Institute of Optics and Electronics, Chinese Academy of Sciences
Institute of Optics and Electronics, Chinese Academy of Sciences
Register Now
More Exhibitors
200+ New Optoelectronic Companies will Gather
at this Three-day Event
Sifotonics Technologies (Nanjing) Co., Ltd.
Sifotonics Technologies (Nanjing) Co., Ltd.
HiSilicon Optoelectronics Co., Ltd.
HiSilicon Optoelectronics Co., Ltd.
Triple-stone Technology Co., Ltd.
Triple-stone Technology Co., Ltd.
Wuhan HGLaser Engineering Co., Ltd.
Wuhan HGLaser Engineering Co., Ltd.
Suzhou Everbright Photonics Co., Ltd.
Suzhou Everbright Photonics Co., Ltd.
Syntec Technology Co., Ltd.
Syntec Technology Co., Ltd.
Nanjing VPS Semiconductor Technology Co., Ltd.
Nanjing VPS Semiconductor Technology Co., Ltd.
Shenzhen Creator Inventor Connector Science and Technology Co., Ltd.
Shenzhen Creator Inventor Connector Science and Technology Co., Ltd.
Unl-Trend Technology (China) Co., Ltd.
Unl-Trend Technology (China) Co., Ltd.
ASM Pacific Technology Ltd.
ASM Pacific Technology Ltd.
Jiangsu Sujing Group Co., Ltd.
Jiangsu Sujing Group Co., Ltd.
Hexagon Metrology (Qingdao) Co., Ltd.
Hexagon Metrology (Qingdao) Co., Ltd.
Shenzhen SkyEye Laser Technology Co., Ltd.
Shenzhen SkyEye Laser Technology Co., Ltd.
Nanjing NanoTech Institute
Nanjing NanoTech Institute
Dajian Optics Co., Ltd.
Dajian Optics Co., Ltd.
MantisVision Technologies Co., Ltd.
MantisVision Technologies Co., Ltd.
Register Now
More Exhibitors
About CIOE
CIOE 2020
Why Attend
Conference
Silicon Photonics Forum
IR Forum
Conference
LiDAR Forum
3D Sensing Forum
Travel info
Invitation Letter
Contact Us
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BDCC 2020 going virtual – Conference Big Data for Sustainable Cognitive Computing | Submit your paper and get more citations & extra exposure by presenting online to a global audience (December 18-19, 2020) Springer, Scopus, ISI, more

Web version

December 18 – 19, 2020 | Coimbatore, India Cyberspace
Submission Deadline: September 21, 2020 (extended)

EAI is proud to announce that BDCC is going virtual and beyond borders.

Get the same full publication and indexing, enjoy EAI’s fair evaluation and recognition, present your paper to a global audience, and experience virtual meetings live as well as on-demand from the safety and comfort of your home.

BDCC 2020 will take place online due to safety concerns and travel restrictions caused by COVID-19. Although we will miss having everyone meet and connect in person, we feel strongly that knowledge exchange must continue, if not more so. That is why we have equipped our online conferences with live viewing with chat, virtual Q&A, and a multitude of other measures to provide you with a great experience. All of this while making the registration for co-authors and non-authors completely free to give you the biggest possible audience. You can learn more about EAI’s online conferences here.

sCOPE

BDCC 2020 conference focuses on big data paradigm is an interdisciplinary field bringing together computer science, mathematics, statistics and information theory to analyze data for interpretation and prediction. Big data research is characterized by voluminous and incremental datasets and complex data methods. The machine learning methods used in algorithm development are iterative and parallel. These methods can be scaled to handle big data using distributed and parallel computing technologies.

BDCC 2020 addresses the issues and challenges posed by several big data problems and give an overview of the state of the art and the future research opportunities.

We are pleased to invite you to submit your paper to BDCC 2020. Submissions should be in English, following the Springer formatting guidelines (see Submission). 

Submit Paper

Read More: Call for Papers

Publication

All registered papers will be submitted for publishing by Springer and made available through SpringerLink Digital Library.

Proceedings will be submitted for inclusion in leading indexing services, Ei Compendex, ISI Web of Science, Scopus, CrossRef, Google Scholar, DBLP, as well as EAI’s own EU Digital Library (EUDL).

Authors of selected papers will be invited to submit an extended version to:

All accepted authors are eligible to submit an extended version in a fast track of:

Additional publication opportunities:

      Important dates

      Full Paper Submission Deadline: September 21, 2020 (extended)

      Notification Deadline: October 12, 2020

      Camera-ready deadline: November 2, 2020 

      Conference dates: DECEMBER 18 – 19, 2020

      CALL FOR WORKSHOP PAPERS

      BDCC 2020 will hold following international workshops, seeking high-quality original research papers:

      Worshop on Big Data in Intelligent and Information Systems

      Submit Workshop Paper

      Workshop on Smart Sensor Networks and Big Data Management

      Submit Workshop Paper

      1st International Workshop on Multimodal Affect and Aesthetic Experience, 22nd ACM International Conference on Multimodal Interaction, 2020

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      1st International Workshop on Multimodal Affect and Aesthetic Experience (MAAE)

      Utrecht, the Netherlands, October, 2020

       

      AIM AND TOPICS

       

      Within attempts to understand art, both past and recent research efforts had focused on exploring accounts given by writers, artists and philosophers as well as on exploring debates about empathy in aesthetic experience. However, both in the aforementioned experiences and in similar ones the affective states resulting or likely to result due to the exposition of the users to art content were not measured but based on written reports on interactive questionnaires about a narrative-verbal form of art. Similarly, recent work has explored the interaction of the human with the urban environment. Depending on its shape and structure, the urban environment can serve as a significant factor for promoting human content, but also contributing to its decline. Measuring multimodal affective reactions would provide the means for better understanding emotions elicited from objects or moments of aesthetic value.

       

      The term “aesthetic experience” corresponds to the inner state of a person exposed to form and content of artistic objects. Exploring certain aesthetic values of artistic objects, as well as interpreting the aesthetic experience of people when exposed to art can contribute towards understanding (a) art and (b) people’s affective reactions to artwork. Focusing on different types of artistic content, such as movies, music, urban art and other artwork, the goal of this workshop is to enhance the interdisciplinary collaboration between affective computing and aesthetics researchers.

       

      TOPICS

       

      Topics of interests include, but are not limited to:

      •              Multimodal data collection in response to artistic objects

      •              Emotions and aesthetic experience

      •              Qualitative and quantitative evaluation of the experience and absorption of aesthetic values

      •              Analysis of physiological and behavioural signals captured during aesthetic experience

      •              Assessment of affective states in response to movies, music, and other artwork

      •              Content analysis of artistic objects (movies, music, paintings, games, etc.)

      •              Intrapersonal and interpersonal correlation of multimodal responses during aesthetic experience

      •              Neuroaesthetics for studying the underlaying brain mechanisms and sensory, reward, emotional neural processes related to aesthetics

      •              Human-habitat interaction and its relation to human content and well-being

       

      IMPORTANT DATES

      •              Submission deadline extended: August 20th 2020 August 31st 2020

      •              Author notification: September 18th 2020

      •              Camera-ready submission: September 30th 2020

      •              ICMI 2020: October 2020

       

      PAPERS

       

      We invite the submission of papers (max 8 pages), short papers and demos (max 4 pages) and abstracts (max 1 page).  References do not count towards the page limit. All papers can have additional pages beyond their page limits that are used exclusively for references. 

       

      According to the ICMI 2018 guidelines, the reviewing will be double blind, so submissions should be anonymous: do not include the authors’ names, affiliations or any clearly identifiable information in the paper. It is appropriate to cite past work of the authors if these citations are treated like any other (e.g., “Smith approached this problem by….”) – omit references only if it would be obviously identifying the authors. Submitted papers should conform to the ACM publication format. For templates and examples, please here. Note: Please use the latest ACM_SigConf format for both short and long paper submissions.

       

      The workshop proceedings will be published in the ACM Digital Library.

       

      SUBMISSION

      https://easychair.org/conferences/?conf=maae2020  

       

      WORKSHOP ORGANIZERS

       

      •              Theodoros Kostoulas (Bournemouth University)

      •              Michal Muszynski (University of Geneva and Carnegie Mellon University)

      •              Theodora Chaspari (Texas A&M University)

      •              Panos Amelidis (Bournemouth University)

       

      INFO AND DETAILS

      https://sites.google.com/view/maae2020

      Multiple Master’s, Ph.D., Postdoc and Research Associate positions at ÉTS Montreal in Canada – FlexNGIA and MaDHoc Projects

      Dear all,

       

      ÉTS Montreal in Canada (University of Quebec) has multiple fully-funded open Master’s, Ph.D., Postdoc and Research Associate positions for two new projects:

       

      1) Project 1: FlexNGIA Project: A Fully-Flexible Internet Architecture for the Next-Generation Tactile Internet. For details, please check https://www.flexngia.net/

       

      2) Project 2: MaDHoc Project: Distributed AI for Mobile Ad Hoc Clouds in the area machine learning applied to mobile Ad Hoc clouds. For details, please check https://arxiv.org/pdf/1806.04311.pdf

       

      The recruited members are expected to conduct research, design and develop novel solutions to address the research challenges related to each project as described in the links provided above.

       

      To apply for these positions, please check https://www.flexngia.net/hiring

       

      Kindest regards,

      Faten–

      Design by 2b Consult