Wearables in Healthcare – Call for Papers | Lecco, Italy on June 9-11, 2020

Web version

June 9 – 11, 2020 | Lecco, Italy
Submission Deadline: February 21, 2020 (extended)

Submit Paper
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HealthWear 2020 will bring together researchers, developers, designer and industry professionals from both Healthcare community and University to discuss key issues, opportunities and obstacles for personal health data research. These include challenges of capturing, summarizing, presenting and retrieving relevant information from heterogeneous sources to support a new vision of pervasive personal healthcare.

We are pleased to invite you to submit your papers to HealthWear 2020. Submissions should be in English, following the Springer formatting guidelines (see Submission).

Read more: Call for Papers

Keynote Speaker


Prof. David Atienza

EPFL, Switzerland

Title of Keynote: "Mimicking the Brain for Energy-Minimal Smart Wearables"

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Publications

All accepted and presented papers will be submitted for publishing by Springer and made available through SpringerLink Digital Library.

Proceedings will be submitted for inclusion in leading indexing services, including Ei Compendex, ISI Web of Science, Scopus, CrossRef, Google Scholar, DBLP, as well as EAI’s own EU Digital Library (EUDL).

Authors of selected papers will be invited to submit an extended version to:

Additionally, selected papers will be considered to be included in:

Important dates

Full Paper Submission Deadline: February 21, 2020 (extended)

Notification Deadline: March 23, 2020

Camera-ready deadline: April 20, 2020

Conference dates: June 9 – 11, 2020
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Becas del Gobierno de Chile 2020 – Agencia Chilena de Cooperación Internacional para el Desarrollo (AGCID)

Reenviamos información recibida del CIN para su difusión.
Saludos cordiales


1-"III Curso Internacional Gestión Sostenible de Residuos en América Latina y el Caribe", en Valparaíso-Chile desde el 01 de junio al 26 de junio de 2020. Fecha de cierre DGCIN: 2 de marzo de 2020.

Las personas interesadas podrán encontrar detalles relacionados a requisitos, beneficios y formularios para completar, en el siguiente link:


2-"V Diploma en Sismología", Santiago de Chile, desde el 22 de junio al 17 de julio de 2020 (fase a distancia) y desde el 20 de julio al 7 de agosto de 2020 (fase presencial) Fecha de cierre DGCIN: 20 de abril de 2020.

Las personas interesadas podrán encontrar detalles relacionados a requisitos, beneficios y formularios para completar, en el siguiente link:

Todas las candidaturas deberán ser presentadas en formato papel ante las oficinas de esta Dirección General de Cooperación Internacional (DGCIN) antes de las fechas de cierre indicadas como "Fecha de cierre DGCIN". Las postulaciones que se encuentren incompletas o presentadas fuera de los plazos indicados, no podrán ser consideradas por esta DGCIN para ser presentadas ante el Ministerio de Relaciones Exteriores de Chile.

Adjuntos: Instructivo de aplicación Chile, Nota Solicitud DGCIN 2020.

Para mayor información enviar un correo al Lic. Juan José Graciano becasinternacionales@cancilleria.gov.ar

Tel: 54-11-48197282.


Cordiales saludos

Laura Satragno

Área de Becas Internacionales
Dirección General de Cooperación Internacional – DGCIN –
Ministerio de Relaciones Exteriores Comercio Internacional y Culto
Esmeralda 1212, piso 12 of. 1204 (C1007ABR) CABA.
Tel: 54-11-48197460 de 11 a 13hs. 

Call for Paper MIDAS 2020 (UPES-INDIA)

 International Conference

On

MACHINE INTELLIGENCE AND DATA SCIENCE APPLICATIONS (MIDAS-2020)

In Collaboration with Next Generation Computing Technologies (NGCT)

4-5 Sept., 2020

Organized by

 School of Computer Science 

UNIVERSITY OF PETROLEUM AND ENERGY STUDIES (UPES)-DEHRADUN-INDIA

 

 

Conference Website: http://ngct.org/ngct2020

 

Dear Sir/Madam,

 

Greetings!

 

International Conference on Machine Intelligence and Data Science Applications will be held at University of Petroleum and Energy Studies-Dehradun, during 4th-5th Sept. 2020. 

 

MIDAS-2020 aims to promote and provide a platform for researchers, academia and practitioners to meet and exchange ideas on recent theoretical and applied Machine and Artificial Intelligence and Data Sciences research.  


The conference will provide a platform for the computer science, computer engineering, and information technology professionals, scientists, researchers, engineers, educators and students from all over the world to share their scientific contributions, ideas and views.  

 

Machine Intelligence and Data Science are the most useful technologies that could powerfully improve Human Life. This is done through merging both for solving complex problems in various fields.  This book provides detailed overview on latest advancements and applications in the field of Machine Intelligence and Data Science. AI/ML applications have achieved great accuracy and performance with the help of the advancements in data processing and storage. AI/ML applications gained power through the amount and quality of data.   

 

The contributors are expected to further the knowhow on state-of-the art research challenges, results, architecture, applications, and other achievements in (but not limited to) the following topics:

 

Track 1:
Machine Learning Algorithms
• Computational Intelligence
• Cognitive Intelligence
• Ambient Intelligence
• Deep Learning
• Intelligent Systems

Track 2:
Data Analytics and Optimization
• Data Pre-Processing
• Big Data Analytics
• Soft Computing
• Evolutionary Computing
• Nature Inspired Computing
• Predictive Analysis

Track 3:
 Machine Intelligence Applications
• Image Processing
• Natural Language Processing
• Computer Vision
• Sentiment Analysis
• Search Engine Optimization
• Speech and Gesture Analysis
• Augmented/Virtual Reality

Track 4:
 Machine Intelligence in Interdisciplinary Areas
• AI in Legal
• AI in Healthcare and Medicine
• Smart Society
• Smart Farming
• IoT
• Cyber Physical System
• Robotics

 

Other Topics:

Deep Learning for Data Intelligence
AI for Business data analytics
Performance Tuning and optimization for Big Data Using AI.
Data Science Visualization using AI
Optimization for machine Learning and Data mining in Big Data
AI in securing Data
Data Science for Industry 4.
Data Science and AI in e-Government and Society
Big Data Fusion using AI
AI for Big Social Data Analysis
Artificial Intelligence for knowledge management and big data, data analytics
AI for Data Stream Mining
AI for massive scale data science
AI in Data informatics
IoT sensor Data Analysis and Fusion
Big Special Data Analytics
Cost Modeling using AI
Case studies of use of data science and AI applications in engineering, healthcare, business
AI applications and Innovations
Research trends, challenges, and the future of AI in Data Science.

 

Publication

All accepted and registered and presented papers under MIDAS-2020 conference will be published in Springer  in the book series Algorithms for Intelligent Systems” (https://www.springer.com/series/16171).

 

 

Major attraction: Few quality papers will be further invited to be extended and considered for publication in  FREE indexed journal:

 

https://www.springer.com/journal/41324  

 

 

Important Dates:

Early Track :

Paper Submission Last date               : 15th March 2020

Author Notification                            : 15th April   2020

Registration Deadline                        : 30th April   2020

 

Regular Track:

Paper Submission Last date               : 15th June  2020

Author Notification                            : 10th July   2020

Registration Deadline                        : 20th July   2020

 

Conference Dates                            : Sept. 4-5, 2020

 

 All papers must be submitted online via EasyChair submission portal using the following link:

 https://easychair.org/conferences/?conf=midas2020

 

CFP on Easychair: 

 

https://easychair.org/cfp/midas2020

 

 

We seek active participation from you, your students, research scholars and other faculty members of your institution/research organizations. Kindly make a wide circulation among your faculty members and other students, research scholars.

 

For any queries related to the paper submission and publications (in this conference), please feel free to contact at icmidas2020@gmail.com /+91-9711938087/+91-8902691510/+91-8439363671

 

 Please visit conference website for more details:    http://ngct.org/ngct2020

 

 

Thanking You

With Best Regards

MIDAS-2020 Team

( Please circulate it to your colleagues)

 

Thanks & Best Regards,

upes-new-logo

Dr.(Mr.)Tanupriya Choudhury, MIET

cid:<a href=image002.jpg@01D57234.7BDD8A80“>
Associate Professor,Dept. of Informatics
School of Computer Science

University of Petroleum & Energy Studies (UPES)

Dehradun- 248 007  (Uttarakhand), India

Email tanupriya@ddn.upes.ac.in; tanupriya1986@gmail.com
Mobile: (+91)
9711938087 (Whatsapp)/ +91-9910803601 (Calling)

cid:<a href=1511757261.2145.3.camel@ddn.upes.ac.in“>

 

 

 

Call for Papers S+SSPR 2020

CALL FOR PAPERS
IAPR Joint International Workshops on
13th Statistical Techniques in Pattern Recognition (SPR)
18th Structural and Syntactic Pattern Recognition Workshop (SSPR)

Time and place: 8-11 September 2020, Padova, Italy
Paper submission deadline: 8 June 2020

S+SSPR 2020 is a joint event organised by Technical Committee 1 (Statistical Pattern Recognition Technique) and Technical Committee 2 (Structural and Syntactical Pattern Recognition) of the International Association of Pattern Recognition (IAPR). Following the trend of previous editions, S+SSPR 2020 will be held in close proximity and shortly before the International Conference on Pattern Recognition (ICPR). Authors are invited to submit papers addressing topics in statistical, structural or syntactic pattern recognition and their applications. Accepted papers will be published in Springer’s Lecture Notes in Computer Science (LNCS) series.

For details see: http://www.dais.unive.it/sspr2020/

Release of TEASER++: Certifiable 3D Registration

Dear Colleagues,

 

We are excited to release the code of the paper “TEASER: Fast and Certifiable Point Cloud Registration”.

 

The code solves challenging 3D registration problems (also known as point cloud alignment or scan matching) where many (e.g., 99%) point correspondences (e.g., from traditional or deep-learned descriptors) are incorrect.

 

Our algorithm (TEASER++)

  • runs in milliseconds and outperforms popular alternatives (e.g., RANSAC,  Fast Global Registration, GORE)
  • is extremely robust (>99% outlier correspondences). TEASER++ can even solve correspondence-free registration (with up to few hundred points) using all-to-all correspondences.
  • is certifiable: it either confirms it was able to find the best solution given the data, or declares failure (it is the first certifiable algorithm for outlier-corrupted problems).
  • It provides formal performance guarantees (first of their kind for robust registration).

 

Paper: https://arxiv.org/abs/2001.07715 (conference version: https://arxiv.org/abs/1903.08588)

Code: https://github.com/MIT-SPARK/TEASER-plusplus

Video: https://youtu.be/xib1RSUoeeQ

 

TEASER++ can be used in many applications from object detection, scan matching, 3D reconstruction, panorama stitching, and medical imaging.

 

The certification routine is currently given in Matlab and will be released in C++ shortly.

We will keep maintaining TEASER++ so feel free to ping us with github issues if you have comments or questions.

 

We hope you find it useful!

 

All the best,

 

Luca, Hank, Jingnan

 

——————————————————————————————

Luca Carlone

Charles Stark Draper Assistant Professor

Department of Aeronautics and Astronautics

Laboratory for Information and Decision Systems (LIDS)

Massachusetts Institute of Technology (MIT)

office: 77 Massachusetts Ave, Cambridge, MA 02139, Room: 31-243

website: https://lucacarlone.mit.edu/

Spark Lab: http://web.mit.edu/sparklab/   

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