2023 IEEE International Humanitarian Technologies Conference: CFP deadline extension

If you cannot see the e-mail, you can view the information at https://2023.ieee-ihtc.org/.

2023 IEEE International Humanitarian Technologies Conference
(IEEE IHTC 2023)
November 1‐3, 2023, Cartagena de Indias – Colombia

 

Dear Researchers and Innovators,

We are excited to announce that, due to overwhelming interest and the desire to accommodate more valuable contributions, the submission deadline for the IEEE International Humanitarian Technology Conference has been extended!

This extension provides you with additional time to finalize your research, polish your findings, and submit your innovative papers. We believe that your contributions hold immense potential to drive positive change, address critical humanitarian challenges, and pave the way for impactful technological solutions.

The new submission deadline is now Aug 15th. We encourage you to take full advantage of this opportunity and submit your work before the updated deadline.

This conference is an exceptional platform to showcase your research, connect with like-minded professionals, and engage in meaningful discussions about leveraging technology for humanitarian purposes. We eagerly await your submissions and look forward to the thought-provoking ideas and solutions you will bring to the conference.

Don't miss this chance to be part of an inspiring event that can make a real difference in the world. Join us at the IEEE International Humanitarian Technology Conference and be a catalyst for positive change.

For detailed submission guidelines and more information, please visit our conference website: www.ieee-ihtc.org.

Thank you for your dedication to advancing technology for the greater good. Together, we can create a brighter future through innovation and collaboration.

Latin America – Region 9 : https://r9.ieee.org/

2023 IEEE MTT-S Latin America Microwave Conference (LAMC) in Costa Rica, final deadline for paper submission

 
 
 
 
 
LAMC 2023
 
 

The fourth edition of the Latin America Microwave Conference (LAMC) will take place in San Jose, Costa Rica, on 6-8 December 2023, at the Wyndham Herradura Hotel and Convention Center. After three successful editions in Puerto Vallarta, Mexico (2016), Arequipa, Peru (2018), and Cali, Colombia (2021, virtual), LAMC returns fully presential to San Jose as a high-quality technical forum for the Latin America Region and all the MTT-S community.

We encourage the submission of original, unpublished research focused on (but not limited to) the following topics of interest: passive components, circuits, and devices; active devices, circuits, and subsystems; RF systems and applications; active and passive antennas; signal-power integrity and high-speed digital techniques; and CAD techniques for RF and microwave engineering.

IMPORTANT DATES (final deadline extension for paper submission):
Conference Days: 6-8 December 2023
Papers submission: 21 August 2023
Notification of acceptance: 11 September 2023
Accepted Papers final submission: 1 October 2023

Conference Website:
https://www.lamc-ieee.org/

Contact Information:

Prof. Renato Rimolo-Donadio
LAMC 2023 General Chair
rrimolo@tec.ac.cr

Prof. Jose Ernesto Rayas-Sanchez
LAMC 2023 General Co-Chair
erayas@iteso.mx

 
 
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Call for Papers for the International Journal of Distributed Systems and Technologies (IJDST)

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Learn More About the Editor-in-Chief of the International Journal of Distributed Systems and Technologies (IJDST)

Editor-in-Chief:

Nik Bessis

 View Biography

 

 

Submit Your Manuscript to This Highly Cited Gold Open Access Journal

This journal is currently seeking submissions in the following research areas, among other topics:

 

Distributed concepts, systems, applications, technologies, and advanced paradigms for early warning systems, evacuation processes, climate changes, disaster management, and threat detection including geographical information systems and health informatics Distributed strategies and practices for e-society, global economies, developing countries, and education Novel algorithms, uses, and implications of distributed concepts, models, architectures, technologies, and practices for example in Internet, wireless communications, mobile, ad-hoc networks, and sensors

Review Full List of Research Areas>

 

 

 

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Indexed In:

Compendex (Elsevier Engineering Index), INSPEC, SCOPUS, Web of Science Emerging Sources Citation Index (ESCI) and 11 more indices

 

Published: Continuous Volume by IGI Global, USA

Established: 2010

ISSN: 1947-3532|EISSN: 1947-3540|DOI: 10.4018/IJDST

 

Your Manuscript

 

Important Educational Resources About Open Access Publishing:

 

Exposing Common Misconceptions About Open Access Publishing

Read More>

Article Processing Charges:

What They Are and Why They Exist

Read More>

IGI Global Achieves Remarkable Open Access Transformation…

Read More>

 

 

Why Should You Publish Open Access With IGI Global?

 

  • Timely Publication: Quick Turnarounds & Prompt Peer Review (No Embargoes)
  • Continuous Support: In-House, Personalized Service Throughout the Entire Process
  • Cutting-Edge Technology: Proprietary IGI Global Technologies & Integrations With Major Open Access Resources & Platforms
  • Diverse Open Access Options: Individual APCs, Platinum Funding, Institutional Open Access Agreements, & More
  • Research Advancement First: IGI Global Prioritizes Research Over Profit by Forfeiting Subscription Revenue

 

 

  • Unmatched Transparency: Comprehensive Visibility in Processes, Licensing, & More
  • Pioneering Rapid Open Access Transformation: IGI Global is One of Few Publishers That Have Completed the Open Access Transition
  • Independence and Integrity: IGI Global is Committed to Maintaining its Autonomy as an Independent Publisher
  • Medium-Sized, Yet Powerful: IGI Global Offers Advantages of a Medium-Sized Publisher With the Reach of a Larger Publisher

 

We welcome you to share this call for papers with your colleagues and professional networks that would find this of interest. You can also find additional information about IJDST by accessing its webpage here.

 

Alternatively, you can contact the editor-in-chief at nik.bessis@googlemail.com or IGI Global’s Open Access Team at openaccessadmin@igi-global.com with other any questions you might have.

 

 

 

Best Regards,

 


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Extension Call for Papers LACCEI International Multiconference on Entrepreneurship Innovation and Regional Development – LEIRD 2023


“Igniting the Spark of Innovation: Emerging Trends, Disruptive Technologies, and Innovative Models for Business Success”

December 4 – 6, 2023

Extension Call for Papers

LEIRD 2023

New Deadline: August 21st, 2023

TRACKS:

1. General in entrepreneurship and innovation:

§  Design thinking-driven innovation

§  Incubators,accelerators, and other support programs

§  Intrapreneurship and business model innovation

§  Social innovation and entrepreneurship

§  Venture formationprocesses, funding, and strategies

 

2. Global and regional in entrepreneurship and innovation:

§  Enabling regionalinitiatives in entrepreneurship and innovation

§  Internationalinnovation and entrepreneurship

§  SustainableInnovation and Entrepreneurship

 

3. Financial inentrepreneurship and innovation:

§  Circular economyinnovation and Frugal innovation

§  Entrepreneurship andinnovation to overcome the economic and financial crisis

§  Market and financialimpacts of entrepreneurship and innovation

 

4. Technological in entrepreneurship and innovation:

§  Communicationstrategies and Social Networks in entrepreneurship and innovation

§  Digitaltransformation and artificial intelligence

 

5. Innovativetechnologies, cities, and regions:

§  Educational inentrepreneurship and innovation

§  Entrepreneurship andinnovation in education

§  Intellectual propertyand open innovation

§  Strategies, policies,and management practices in R&D, innovation, and entrepreneurship

§  University-Industrytechnology transfer and knowledge exchange

 

6. Entrepreneurshipand Innovation Student Competition (E&I23)

Visit: https://laccei.org/leird2023/

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