CFP Proceedings by Springer – 7th ICTIS 2023, Ahmedabad, India

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7th ICTIS 2023 ( Proceedings by Springer ) | 27 – 28 April 2023 | Ahmedabad, India
Seventh International Conference on Information and Communication Technology for Intelligent Systems 
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Important Date : February 24, 2023 [ Paper Submission Deadline ]

Venue : Pride Plaza Hotel, Ahmedabad, India

Publication : All ICTIS 2023 presented papers will be published in conference proceedings by Springer SIST.ISSN Number – 2190-3018, Series : https://www.springer.com/series/8767

Indexing : Indexed by SCOPUS, EI Compendex, INSPEC, WTI Frankfurt eG, zbMATH, Japanese Science and Technology Agency (JST), SCImago, DBLP. All books published in the series are submitted for consideration in the Web of Science.

Previous Publications :  All previous ICTIS conferences in 2022, 2021, 2020, 2018, 2017, 2015 were published by Springer SIST, For previous publication details visit : https://ictis.in/publication.php  

Papers Submission :  Submissions of high quality papers in all areas of ICT and its applications. The submissions are handled only through the Conference website at: https://ictis.in/ictis.php#section04

Organized & By : Global Knowledge Research Foundation & G R Scholastic LLP

Associated Partners : InterYIT IFIP – International Federation for Information Processing & KCCI – Knowledge Chamber Of Commerce And Industry.

Dear Friends and Colleagues,

Seventh International Conference on ICT for Intelligent Systems (ICTIS – 2023) will be held at Ahmedabad, India during April 27– 28, 2023. It will target state-of-the-art as well as emerging topics pertaining to ICT and effective strategies for its implementation on Intelligent Systems. The objective of this International conference is to provide opportunities for the Researchers, Academicians, Industry persons and students to interact and exchange ideas, experience and expertise in the current trend and strategies for ICT for Intelligent Systems. Besides this, participants will also be enlightened about vast avenues, current and emerging technological developments in the ICT Domain and its applications will be thoroughly explored and discussed.

 
The Topics of interest include but are not limited to the following link  : http://ictis.in/ictis.php#section05 
 
Authors are kindly invited to submit their formatted full papers including results, tables, figures, and references. All submissions are handled through the Conference Website : https://ictis.in/ictis.php#section04 
 
For any query, write mail on info@ictis.in or a drop message on http://ictis.in/contact-us.php  

Call For Papers American Electron Devices Conference (LAEDC 2023)

 
 
 
 
 
LAEDC 2023
 
 

CALL FOR PAPERS

2023 IEEE Latin American Electron Devices Conference, LAEDC

It is our pleasure to invite you to attend the fifth edition of the IEEE Latin American Electron Devices Conference, LAEDC 2023. A three-day event to be held at the hotel Presidente Intercontinental in Puebla, Mexico from 3-5 July 2023.

Puebla, officially Heroica Puebla de Zaragoza, is the capital of the homonymous state and the fourth largest city in Mexico. It is located in a valley framed by mountains and volcanoes, including Iztaccíhuatl, Popocatépetl, La Malinche and Pico de Orizaba, and is crossed from north to south by the Atoyac River.

LAEDC is the premiere Latin-American Electron Devices and related fields conference sponsored by IEEE’s Electron Device Society (EDS). The main goal is to bring together all Electron Device related fields to provide a unique global opportunity to share with specialists, senior scientists, students as well as young researchers to discuss their latest research and innovations.

The Conference is rapidly growing with worldwide participation and will address key topics in the field of Electron Devices, it will also be geared for students as well as young researchers and is financially sponsored by the IEEE Electron Devices Society (EDS). We are confident that thanks to your significant accomplishments and tangible contributions your presence will significantly add to the value of our conference and will motivate research groups and young generations in the field of Electron devices.

Accepted papers will be submitted for inclusion into IEEE Xplore Digital Library according to conference #58183, 2023 IEEE Latin American Electron Devices Conference (LAEDC), subject to meeting IEEE Xplore’s scope and quality requirements.

Topics of interest

Include, but are not limited to:
• All electron based devices
• Electron Devices for Quantum Computing
• Semiconductor-, MEMS- and Nano-technologies
• Packaging, 3D integration, Sensors and actuators
• Display technology
• Modeling and simulation
• Reliability and yield
• Device characterization
• Energy harvesting
• Biomedical Devices
• RF-MMW-5G
• Circuit-device interaction
• Novel materials and process modules
• Technology roadmaps
• Electron device engineering education
• Electron device outreach
• Optoelectronics, photovoltaic and photonic devices and systems
• Agrivoltaics
• 2D Materials and Devices
• Flexible electronics
• Reliability

Submission Guidelines

• Follow all details and instructions on our site https://attend.ieee.org/laedc-2023
• All papers must be uploaded using EasyChair, following: https://easychair.org/conferences/?conf=laedc2023
• Papers should be presented in English following the IEEE Transactions format for Conference Proceedings https://www.ieee.org/conferences/publishing/templates.html
• Papers must not exceed 4 pages in length.
• Please ignore the header.
• Do not number your pages.
• Authors are required to include the Digital Object Identifier (DOI), where available.
• Each reference cited must have a complete list of authors (no et al.), complete titles, first and last pages numbers, month and year.
• Do not include authors’ bios and photos

Important Dates
• Deadline Paper Submission: 31 March
• Notification of Acceptance: 1 May
• Camera Ready: 5 June
• Conference Dates: 3-5 July 2023

On behalf of the Conference committees, we look forward to welcoming you to LAEDC 2023. Please visit our website mentioned below for further details and registration https://attend.ieee.org/laedc-2023/ . For any questions, do not hesitate to contact us at laedc@ieee.org.

LAEDC 2023 Organizing Committee

Esteban Arias-Méndez | Co-Chair
Cor Claeys | Co-Chair
Mario Aleman | Treasurer and Chapters Summit
Fernando Guarín | Sponsorship and Exhibits
Edmundo Guitiérrez | Technical Program Chair
Pablo Moliterno | Technical Program Co-Chair
Jean Michelle Sallese | Publications Chair
Arturo Escobosa | Publications Co-Chair
Danny Xie-Li | Registration and Web Master
Julio Bello Pavón | Digital Platforms and Web Master
Jacobus Swart | Liaison Brazil
Patricia Guzman | Logistics and Events
Alba Ávila | Summer School Chair and WIE Summit
Lluis Marsal | Mini Colloquium Chair
Benjamin Iñiguez | MOS-AK Chair
Victor Grimblatt | Liaison Chile

Download Call for Papers Flyer: https://attend.ieee.org/laedc-2023/wp-content/uploads/sites/508/LAEDC-2023-CFPaper.pdf

 
 
 
 

ICMR 2023 – 4th workshop on Intelligent cross-data analytics and retrieval

ICMR 2023: 12-15 June 2023 Thessaloniki, Greece

ICDAR 2023 (hybrid) – the 4th workshop on Intelligent Cross-Data Analytics and Retrieval

https://www.xdata.nict.jp/icdar_icmr2023/

 

Data plays a critical role in human life. In the digital era, where data can be collected almost anywhere and anytime, people have access to a vast volume of real-time data that reflects their living environment differently. People can extract necessary information from these data to gain knowledge and become wiser.


Nevertheless, data often comes from multiple sources and only reflects a small part of the big puzzle of life. Despite potentially missing some pieces, the goal is to capture the puzzle's image with the available pieces. The more pieces of data we can collect and assemble within a given frame, the faster we can solve the puzzle. The challenge becomes even more significant when dealing with multimodal data, cross-domain and cross-platform problems. A multimodal data puzzle would be one where pieces have different shapes and sizes. A cross-domain puzzle would be one where the pieces come from distinct sub-pictures. Finally, a cross-platform puzzle would be one where the pieces assembled come from different puzzles. But in all these scenarios, you still have to put the pieces together to get the entire picture. The proposed research topic of “Intelligent Cross-Data Analysis and Retrieval” aims to advance the field of cross-data analytics and retrieval and contribute to developing a more intelligent and sustainable society. This workshop welcomes researchers coming from diverse domains and disciplines, such as well-being, disaster prevention and mitigation, mobility, climate change, tourism, healthcare, and more

 

The proposed research topic of “Intelligent Cross-Data Analysis and Retrieval” aims to advance the field of cross-data analytics and retrieval and contribute to developing a more intelligent and sustainable society. This workshop welcomes researchers from diverse domains and disciplines, including well-being, disaster prevention and mitigation, mobility, climate change, tourism, healthcare, and more.

 

Example topics include, but are not limited to:

       Event-based cross-data retrieval Data mining and AI technology.

       Multimodal complex event processing

       Transfer Learning and Transformers.

       Multimodal self-supervised learning

       Heterogeneous data association discovery.

       Cross-datasets for Repeatable Experimentation.

       Federated Analytics and Federated Learning for cross-data.

       Privacy-public data collaboration.

       Diverse multimodal data Integration.

       Realization of a prosperous and independent region in which people and nature coexist.

       Intelligent cross-data analysis applications from different domains

 

 

Paper submission:

ü  All papers must be formatted according to the ACM proceedings style.

ü  All technical content, including the main text, figures, and tables, without references, should be included within the page limit (eight pages for regular papers and four pages for short papers).

ü  For any over-length submission, we reserve the right to reject it outright on an administrative basis.

 

Important Dates:

ü  Feb. 28, 2023: Deadline for Paper Submission

ü  Mar. 31, 2023: Notification of Acceptance

ü  Apr. 20, 2023: Camera-Ready Paper Due

ü  (TBD) – Workshops Day

 

Organizers*

ü  Guillaume Habault, KDDI Research Inc., Japan

ü  Michael Alexander Riegler, Simula Metropolitan Center for Digital Engineering, Norway

ü  Minh-Son Dao, National Institute of Information and Communications Technology (NICT), Japan

ü  Duc-Tien Dang-Nguyen, Bergen University, Norway

ü  Yuta Nakashima, Osaka University, Japan

ü  Cathal Gurrin, Dublin City University, Ireland

 

Contact:

https://www.xdata.nict.jp/icdar_icmr2023/
https://icmr2023.org/
 xgu-habault@kddi.com>

 dao@nict.go.jp

 

CFP: Special issue on AutoML for Non-Stationary Data

 

I am happy to announce the new special issue with IEEE Transaction on Artificial Intelligence (TAI) is live now and welcome submissions. The theme is “Automated Machine Learning for Non-Stationary Data”.

 

SI website with all the information: http://tai.amlnsd.com

Submission deadline 2nd of June, 2023.

Submission information: https://cis.ieee.org/publications/ieee-transactions-on-artificial-intelligence/information-for-authors-tai

(Please select this special issue in the Manuscript Central System when submitting your paper at Step 1.)

 

Description: Nowadays, data is commonly collected over time and susceptible to changes. A model trained under a false stationarity assumption is bound to become obsolete in time. It also happens to existing Automated Machine Learning (AutoML) systems. For more flexible and robust AutoML models over time, this special issue will integrate the growing international community of researchers working on AutoML and data stream learning, and have a fruitful collection of high-quality papers on the evolution and future development of AutoML.

 

Topics of interest (including but not limited to):

(1) AutoML solutions for temporal data and data streams:

 

l  Change detection techniques

l  Adaptation strategies in AutoML pipelines

l  Online and incremental learning in AutoML

l  Meta learning and lifelong learning

l  Model evaluation methods

l  Dynamic hyperparameter optimization

l  Automated construction of configuration space.

 

(2) Contemporary AutoML:

 

l  Hyperparameter and architecture optimization for non-stationary data

l  Multi-objective AutoML

l  AutoML fairness, interpretability and robustness

l  Transfer learning in AutoML 

l  Human-in-the-Loop AutoML

l  Automated model exploration approaches

l  AutoML in distributed learning environments

l  Automated class imbalance learning

 

(3) Applied and cross-disciplinary topics:

 

l  Spatial-temporal modeling for Geoinformatics

l  Sensory data analysis

l  Computer vision

l  Biometric identification and recognition

l  Automated software engineering systems

l  Healthcare

l  Development of opensource adaptive AutoML systems

 

Editorial team (in alphabetic order): Ran Cheng (Southern University of Science and Technology, China), Hugo Jair Escalante (National Institute of Astrophysics, Optics and Eletronics, Mexico), Jan N van Rijn (Leiden University, Netherlands), Wei-wei Tu (4Paradigm Inc., China), Shuo Wang (University of Birmingham, UK), Yun Yang (Yunnan University, China).

 

Best wishes,

Special issue on AutoML for Non-Stationary Data

 

I am happy to announce the new special issue with IEEE Transaction on Artificial Intelligence (TAI) is live now and welcome submissions. The theme is “Automated Machine Learning for Non-Stationary Data”.

 

SI website with all the information: http://tai.amlnsd.com

Submission deadline 2nd of June, 2023.

Submission information: https://cis.ieee.org/publications/ieee-transactions-on-artificial-intelligence/information-for-authors-tai

(Please select this special issue in the Manuscript Central System when submitting your paper at Step 1.)

 

Description: Nowadays, data is commonly collected over time and susceptible to changes. A model trained under a false stationarity assumption is bound to become obsolete in time. It also happens to existing Automated Machine Learning (AutoML) systems. For more flexible and robust AutoML models over time, this special issue will integrate the growing international community of researchers working on AutoML and data stream learning, and have a fruitful collection of high-quality papers on the evolution and future development of AutoML.

 

Topics of interest (including but not limited to):

(1) AutoML solutions for temporal data and data streams:

 

l  Change detection techniques

l  Adaptation strategies in AutoML pipelines

l  Online and incremental learning in AutoML

l  Meta learning and lifelong learning

l  Model evaluation methods

l  Dynamic hyperparameter optimization

l  Automated construction of configuration space.

 

(2) Contemporary AutoML:

 

l  Hyperparameter and architecture optimization for non-stationary data

l  Multi-objective AutoML

l  AutoML fairness, interpretability and robustness

l  Transfer learning in AutoML 

l  Human-in-the-Loop AutoML

l  Automated model exploration approaches

l  AutoML in distributed learning environments

l  Automated class imbalance learning

 

(3) Applied and cross-disciplinary topics:

 

l  Spatial-temporal modeling for Geoinformatics

l  Sensory data analysis

l  Computer vision

l  Biometric identification and recognition

l  Automated software engineering systems

l  Healthcare

l  Development of opensource adaptive AutoML systems

 

Editorial team (in alphabetic order): Ran Cheng (Southern University of Science and Technology, China), Hugo Jair Escalante (National Institute of Astrophysics, Optics and Eletronics, Mexico), Jan N van Rijn (Leiden University, Netherlands), Wei-wei Tu (4Paradigm Inc., China), Shuo Wang (University of Birmingham, UK), Yun Yang (Yunnan University, China).

 

Best wishes,

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