Special Issue “Advances of Transformers in Medical Imaging”

October 19th, 2022 Daniela Lopez de Luise

Dear Colleague,

The journal Applied Sciences (IF 2.679, https://www.mdpi.com/journal/applsci) is currently running a Special Issue entitled “Advances of Transformers in Medical Imaging”, which is now open for submissions:

https://www.mdpi.com/journal/applsci/special_issues/Transformers_Medical_Imaging

The main aim of this Special Issue is to collect original contributions as either research papers or comprehensive reviews that address and discuss the impact and relevance of the application of transformers models in the medical imaging field. 

The official submission deadline is *31 December 2022*. Manuscripts can be submitted until the deadline. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website.

Benefits of publishing with Applied Sciences:

1. Gold open access: unlimited and free access for readers.

2. High visibility: indexed by the Science Citation Index Expanded (Web of Science) (search for “Applied Sciences-Basel”), Scopus, Inspec (IET), and other databases. The 2020 impact factor for this journal has increased from

2.474 to 2.679.

3. Rapid publication: manuscripts are peer-reviewed, and a first decision is provided to authors approximately 17.7 days after submission; acceptance to publication is undertaken in approximately 3.5 days (median values for papers published in this journal in the first half of 2021).

Please visit the instructions for authors page on the following website before submitting your manuscript:

https://www.mdpi.com/journal/applsci/instructions

Please note that an article processing charge (APC) of CHF 2300 (Swiss Francs) currently applies for each paper accepted for publication in this journal in 2022. 

We look forward to hearing from you soon.

Kind regards,

Dr. Nadia Brancati

Dr. Maria Frucci

Prof. Dr. Daniel Riccio

Dr. Mara Sangiovanni

Guest Editors

Read More »

Call For Participation: Deployable AI Workshop at AAAI-2023

October 19th, 2022 Daniela Lopez de Luise
We are excited to invite submissions to the AAAI 2023 workshop on Deployable AI. This workshop aims to bring together researchers who can build real-world-ready solutions from multiple disciplines/domains and computer researchers and strategists who can ensure and enable the deployability of such AI-based solutions. We have invited several distinguished speakers with their research interests in various topics related to deployable AI.

Call for Participation: We invite submissions from participants who can contribute to theory and techniques/strategies to ensure adherence to the various aspects of the deployability of AI models. The topics of interest include, but are not limited to, the following:
  1. Deployable AI- concepts and Models
  2. Explainable and Interpretable AI
  3. Human-in-the-loop AI
  4. Online Learning and Transfer Learning
  5. Few Shot Learning Model
  6. Fairness and Ethics in AI
  7. Safety Security and Privacy in AI
  8. Cryptography and AI
  9. Responsible AI
  10. Integrity and Robustness in AI
  11. Computational Scalability and Reliability in AI
  12. AI on Edge Devices
  13. Distill and Lightweight AI Models
  14. Learning from Drifting Data Distributions
  15. AI Models and Social Impact
The call for papers can be found here: https://easychair.org/cfp/AAAI-DAI_23
Important Dates

Poster/short/position papers submission deadline: Oct 28, 2022

  • Full paper submission deadline: Oct 28, 2022
  • Paper notification: Nov 18, 2022
  • Author Notification: Friday, November 18, 2022
  • Workshop dates: February 13 – 14, 2023
Regards
The Organizers
Balaraman Ravindran, IIT Madras
Nandan Sudarsanam, IIT Madras
Arun Rajkumar, IIT Madras
Harish Ramaswamy, IIT Madras
Chandrashekar Lakshminarayanan, IIT Madras
Gokul S. Krishnan, IIT Madras
Rahul Vashisht, IIT Madras
Prakhar Krishna, IIT Madras
Read More »

Human Activity Recognition Challenge: OpenPack Challenge 2022

October 19th, 2022 Daniela Lopez de Luise
We would like to announce a human activity recognition competition
using a worker activity sensor dataset of packaging work, named
OpenPack. The task of the competition is very simple: Recognize 10
work operations from the OpenPack dataset.
The top three winners will receive (1) a cash prize and (2) financial
support for travel to the award ceremony at PerCom 2023 Workshop in
Atlanta, USA.
You can find details on our website at https://open-pack.github.io/challenge2022

== Task ==
Recognize 10 Work Operations in OpenPack Dataset

== Dataset ==
OpenPack Dataset (v0.3.x)
OpenPacking Dataset is a new large-scale multi-modal dataset of
packing processes. OpenPack is an open access logistics-dataset for
human activity recognition, which contains 53 hours of human movement
data with 20,129 instances of work operation annotation. In addition,
OpenPack dataset contains data from IoT-enabled devices and rich
metadata such as error annotation and order information.

== Schedule ==
15, Oct, 2022

Read More »

Paper Invitation for Special Issue: Smart Energy Systems Using AI and IoT Solutions (IF 2.690, Citescore 3.7)

October 19th, 2022 Daniela Lopez de Luise
image.png

Paper invitation for the Special Issue “Smart Energy Systems Using AI and IoT Solutions” of Electronics MDPI

Dear Colleagues,

The open access journal Electronics MDPI (ISSN 2079-9292, IF 2.690) is pleased to announce a Special Issue entitled “Smart Energy Systems Using AI and IoT Solutions“.

This Special Issue encourages original papers presenting research on topics involving smart energy systems in many fields, e.g., smart buildings, renewable energy, smart grids, energy communities, smart environments, sustainable industry, etc. The aim is to investigate the architectures and functionalities of AI and IoT solutions to improve the effectiveness of smart energy systems with advanced technologies (e.g., edge computing, blockchain, machine learning, swarm intelligence), to overcome the existing difficulties, and increase efficiency, robustness, and reliability in operation.
The main topics include but are not limited to:
•         Artificial intelligence for IoT
•         Renewable Energies
•         Energy Communities
•         Smart Grid
•         Edge Computing

•         Machine Learning
The submission deadline is 31 March 2023. Papers may be submitted immediately or at any point until 31 March 2023, as papers will be published on an ongoing basis.
For more information on this Special Issue, please visit the following page:  https://www.mdpi.com/journal/electronics/special_issues/18527X9060.

For details on the submission process, please see the instructions for authors on the journal website.
We look forward to hearing from you.

Kind regards,

Dr. Luigi Scarcello
Dr. Carlo Mastroianni
Dr. Teemu Leppänen
Guest Editors

Read More »

Reminder: IEEE R9 – Invitación a CONCAPAN 2022

October 18th, 2022 Daniela Lopez de Luise
If you are having trouble reading this message, click here for the web version.

Miembros IEEE de Región 9,

Nos complace invitarlo a la 2022 IEEE Cuadragésima Convención de Centroamérica y Panamá (CONCAPAN) que se llevará a cabo en la Ciudad de Panamá del 9 al 12 de noviembre de 2022.

CONCAPAN es uno de los eventos tecnológicos internacionales más importantes de la industria eléctrica en la región centroamericana que reúne a cientos de profesionales, desarrolladores e investigadores de la industria y la academia que trabajan en todas las áreas de la ingeniería eléctrica.

Durante este evento se realizan tutoriales, conferencias técnicas y conferencias magistrales en las áreas afines a la Ingeniería Eléctrica y Electrónica del IEEE. Además, ofrece una sala de exhibición en el que participan empresas nacionales e internacionales.

Información de Tutoriales aquí

Información de la Exhibición Técnica aquí

Información de las Conferencias Técnicas aquí

Información de Registro al evento aquí

Información para reservar su habitación de hotel aquí [código corporativo CONC22]

URL del evento: www.ieee.org/concapan2022

Email: concapan2022@ieee.org

 

Su presencia en esta conferencia es importante para nosotros. ¡Los esperamos!

Saludos cordiales,

 

Comité Organizador
CONCAPAN XL, Panamá 2022

Read More »
« Older Entries
Newer Entries »
Design by 2b Consult